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IDT71V65612S166BG8

产品描述ZBT SRAM, 256KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
产品类别存储    存储   
文件大小538KB,共26页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT71V65612S166BG8概述

ZBT SRAM, 256KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

IDT71V65612S166BG8规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA,
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间3.5 ns
JESD-30 代码R-PBGA-B119
JESD-609代码e0
长度22 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX36
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度2.36 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度14 mm

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256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
Features
u
256K x 36, 512K x 18 memory configurations
u
Supports high performance system speed - 200 MHz
u
ZBT
TM
Feature - No dead cycles between write and read cycles
u
Internally synchronized output buffer enable eliminates the
u
Single R/W (READ/WRITE) control pin
u
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
u
4-word burst capability (interleaved or linear)
u
Individual byte write (BW
1
-
BW
4
) control (May tie active)
u
Three chip enables for simple depth expansion
u
3.3V power supply (±5%)
u
2.5V I/O Supply (V
DDQ
)
u
Power down controlled by ZZ input
u
Packaged in a JEDEC standard 100-pin plastic thin quad
need to control
OE
(3.2 ns Clock-to-Data Access)
Preliminary
IDT71V65612
IDT71V65812
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
The IDT71V65612/5812 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Description
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read
or write. The IDT71V65612/5812 contain data I/O, address and control
signal registers. Output enable is the only asynchronous signal and can
be used to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65612/5812
to be suspended as long as necessary. All synchronous inputs are
ignored when (CEN) is high and the internal device registers will hold their
previous values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are
not asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected or
a write is initiated.
The IDT71V65612/5812 has an on-chip burst counter. In the burst
mode, the IDT71V65612/5812 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65612/5812 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA).
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
N/A
N/A
N/A
N/A
Asynchronous
Synchronous
Static
Static
5314 tbl 01
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
TMS
TDI
TCK
TDO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data Input
Test Clock
Test Data Output
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
NOVEMBER 2000
DSC-5314/01
1
©2000 Integrated Device Technology, Inc.

IDT71V65612S166BG8相似产品对比

IDT71V65612S166BG8 IDT71V65812S200BG8 IDT71V65812S166BG8 IDT71V65812S200PF8 IDT71V65612S200BG8 IDT71V65612S166PF8 IDT71V65812S166PF8 IDT71V65612S200PF8
描述 ZBT SRAM, 256KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 512KX18, 3.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 512KX18, 3.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 512KX18, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 ZBT SRAM, 256KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 ZBT SRAM, 256KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA BGA QFP BGA QFP QFP QFP
包装说明 BGA, BGA, BGA, LQFP, BGA, LQFP, LQFP, LQFP,
针数 119 119 119 100 119 100 100 100
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3.5 ns 3.2 ns 3.5 ns 3.2 ns 3.2 ns 3.5 ns 3.5 ns 3.2 ns
JESD-30 代码 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 22 mm 22 mm 22 mm 20 mm 22 mm 20 mm 20 mm 20 mm
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 36 18 18 18 36 36 18 36
湿度敏感等级 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1
端子数量 119 119 119 100 119 100 100 100
字数 262144 words 524288 words 524288 words 524288 words 262144 words 262144 words 524288 words 262144 words
字数代码 256000 512000 512000 512000 256000 256000 512000 256000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 256KX36 512KX18 512KX18 512KX18 256KX36 256KX36 512KX18 256KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA LQFP BGA LQFP LQFP LQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 240 225 240 240 240
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.36 mm 2.36 mm 2.36 mm 1.6 mm 2.36 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL GULL WING BALL GULL WING GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 BOTTOM BOTTOM BOTTOM QUAD BOTTOM QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 20 20 20 20 20
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

 
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