Agilent HDSP-A4xC Series
Alphanumeric Display, 0.54" (13.7 mm)
4 Character As AlInGaP Red
Data Sheet
Features
• As AlInGaP red color
• Gray face paint
Gray package gives optimum
contrast
• Design flexibility
Common anode or common
cathode
Description
These 0.54” (13.7 mm) AS AlInGaP
displays are available in either com-
mon anode or common cathode.
Devices
As AlInGaP Red
HDSP-A42C
HDSP-A47C
Description
Common Anode
Common Cathode
Applications
• Suitable for alphanumeric
• Operating temperature range
–40˚C to 105˚C
Package Dimensions
6.48
(0.255)
0.95
(0.038)
0.160
(0.063)
5º
10.95
(0.431)
PIN 1
16.79
(0.661)
12.10
(0.476)
10.08
(0.397)
1.46
(0.057)
10.08
(0.397)
10.08
(0.397)
5.10
(0.201)
40.45
(1.593)
6.19 (0.244)
2.94 (0.116)
1.94
(0.076)
0.50
(0.020)
4.32
(0.170)
2.02
(0.079)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES)
2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25mm
Part Numbering System
5082 -X X X X-X X X X X
HDSP-X X X X-X X X X X
Mechanical Options
[1]
00: No Mechanical Option
Color Bin Options
[1,2]
0: No Color Bin Limitation
Maximum Intensity Bin
[1,2]
0: No Maximum Intensity Bin Limitation
Minimum Intensity Bin
[1,2]
0: No Minimum Intensity Bin Limitation
Device Configuration/Color
[1]
C: AlInGaP Red
Device Specific Configuration
[1]
Refer to Respective Datasheet
Package
[1]
Refer to Respective Datasheet
Notes:
1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest
Agilent representative for details.
2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1
bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.
2
Internal Circuit
DIG 1
DIG 2
DP1
DIG 3
DIG 4
DP2
COM 2
DIG 2
COM 1
DIG 1
34 29
COM 4
DIG 4
COM 3
DIG 3
11 16
30
28
9
7
1
36
33
32
6
5
4
2
31
35
8
20
25
19
18
12 10
27
22 20
13
17
15 14
24
23
A
B
C
D
E
F
G
H
J
K
L
M
N
P
DP1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
A
B
C
D
E
F
G
H
J
K
L
M
N
P
DP2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
COMMON ANODE
COM 2 COM 2
DIG 2 DIG 2
COM 1
DIG 1
34 29
COM 4
DIG 4
30
28
9
7
1
36
33
32
4
5
6
2
31
35
8
11
COM 3
DIG 3
16 20
25 19
18
12 10
27
22 20
13 17
15 14
24
23
A
B
C
D
E
F
G
H
J
K
L
M
N
P
DP1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
A
B
C
D
E
F
G
H
J
K
L
M
N
P
DP2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
COMMON CATHODE
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Pin Configuration A
Common Anode
1E/2E Cathode
1M/2M Cathode
No Connection
1L/2L Cathode
1K/2K Cathode
1J/2J Cathode
1D/2D Cathode
DP2 Cathode
1C/2C Cathode
3E/4E Cathode
DIGIT No. 3 Common
3D/4D Cathode
3J/4J Cathode
3M/4M Cathode
3L/4L Cathode
DIGIT No. 4 Common
3K/4K Cathode
3C/4C Cathode
3B/4B Cathode
3H/4H Cathode
No Connection
3G/4G Cathode
3P/4P Cathode
3N/4N Cathode
3A/4A Cathode
DP1 Cathode
3F/4F Cathode
1B/2B Cathode
DIGIT No. 2 Common
1A/2A Cathode
1N/2N Cathode
1H/2H Cathode
1G/2G Cathode
DIGIT No. 2 Common
1P/2P Cathode
1F/2F Cathode
Pin Configuration B
Common Cathode
1E/2E Anode
1M/2M Anode
No Connection
1L/2L Anode
1K/2K Anode
1J/2J Anode
1D/2D Anode
DP2 Anode
1C/2C Anode
3E/4E Anode
DIGIT No. 3 Common
3D/4D Anode
3J/4J Anode
3M/4M Anode
3L/4L Anode
DIGIT No. 4 Common
3K/4K Anode
3C/4C Anode
3B/4B Anode
3H/4H Anode
No Connection
3G/4G Anode
3P/4P Anode
3N/4N Anode
3A/4A Anode
DP1 Anode
3F/4F Anode
1B/2B Anode
DIGIT No. 2 Common
1A/2A Anode
1N/2N Anode
1H/2H Anode
1G/2G Anode
DIGIT No. 2 Common
1P/2P Anode
1F/2F Anode
Anode
Cathode
Anode
Cathode
Anode
Cathode
Anode
Cathode
3
Absolute Maximum Ratings at T
A
= 25˚C
Description
DC Forward Current per Segment or DP
[1,2,3]
Peak Forward Current per Segment or DP
[2,3]
Average Forward Current
[3]
Reverse Voltage per Segment or DP (I
R
= 100
µA)
Operating Temperature
Storage Temperature
Lead Soldering Conditions
Symbol
I
F
I
PEAK
I
AVE
V
R
T
O
T
S
Temperature
Time
HDSP-A42C/HDSP-A47C
50
100
30
5
–40 to +105
–40 to +120
260
3
Units
mA
mA
mA
V
˚C
˚C
˚C
s
Notes:
1. Derate linearly as shown in Figure 1.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more
information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Optical/Electrical Characteristics at T
A
= 25˚C
Device
Series
HDSP-
A42C
A47C
Parameter
Forward Voltage
Reverse Voltage
Peak Wavelength
Symbol
I
V
V
R
λ
PEAK
Min.
1.70
5
Typ.
1.90
20
635
Max.
2.20
Units
V
V
nm
Test Conditions
I
F
= 20 mA
I
F
= 100
µA
Peak Wavelength
of Spectral Distri-
bution at I
F
= 20 mA
Wavelength Width
at Spectral Distri-
bution 1/2 Power
Point at I
F
= 20 mA
Exponential Time
Constant, e
-tτs
V
F
= 0, f = 1 MHz
Dominant Wavelength
[3]
Spectral Halfwidth
λ
d
∆λ
1/2
622.5
626
17
630
nm
nm
Speed of Response
Capacitance
τ
s
C
20
40
ns
pF
Intensity Bin Limits
[1]
(mcd at 10 mA)
Bin Name
Min.
[2]
T
18.0
U
25.0
Max.
[2]
25.0
36.0
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all bin categories.
2. Tolerance for each bin limit is
±
10%.
4
I
F
– FORWARD CURRENT PER SEGMENT – mA
I
F
– MAXIMUM AVERAGE CURRENT – mA
60
50
40
30
20
10
0
120
3.5
RELATIVE LUMINOUS INTENSITY
(NORMALIZED TO 1 AT 10 mA)
1.0
1.5
2.0
2.5
3.0
100
80
60
40
20
0
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0
0
10
20
30
40
50
60
0
20
40
60
80
100
120
T
A
– AMBIENT TEMPERATURE – ˚C
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT PER SEGMENT – mA
Figure 1. Maximum forward current vs.
ambient temperature. Derating based on
T
JMAX
= 130˚C.
Figure 2. Forward current vs. forwrad
voltage.
Figure 3. Relative luminous intensity vs. DC
forward current.
1.4
RELATIVE EFFICIENCY
(NORMALIZED TO 1 AT 10 mA)
1.2
1.0
0.8
0.6
0.4
0.2
0
Contrast Enhancement
For information on contrast
enhancement, please see
Application Note 1015.
Soldering/Cleaning
Cleaning agents from ketone
family (acetone, methyl ethyl
ketone, etc.) and from the
chlorinated hydrocarbon family
(methylene chloride,
trichloroethylene, carbon
tetrachloride, etc.) are not
recommended for cleaning LED
parts. All of these various
solvents attack or dissolve the
encapsulating epoxies used to
form the package of plastic LED
parts.
For information on soldering
LEDs, please refer to Application
Note 1027.
0
10
20
30
40
50
60
I
PEAK
– PEAK FORWARD CURRENT
PER SEGMENT – mA
Figure 4. Relative efficiency (luminous
intensity per unit current) vs. peak current.
5
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