Transistor
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Micro Commercial Components (MCC) |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| JESD-609代码 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 2SC1959-A | 2SC1959-GR | 2SC1959-O | 2SC1959-Y | 2SC1959-BP | 2SC1959-AP | 2SC1959-B | |
|---|---|---|---|---|---|---|---|
| 描述 | Transistor | Small Signal Bipolar Transistor, 0.5A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-92, PLASTIC PACKAGE-3 | Small Signal Bipolar Transistor, 0.5A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-92, PLASTIC PACKAGE-3 | Small Signal Bipolar Transistor, 0.5A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-92, PLASTIC PACKAGE-3 | Small Signal Bipolar Transistor, 0.5A I(C), 30V V(BR)CEO, 1-Element, NPN, Silicon, TO-92, PLASTIC PACKAGE-3 | Transistor, | Transistor |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| Reach Compliance Code | unknown | compli | compli | compli | compli | compliant | unknown |
| JESD-609代码 | e0 | e0 | e0 | e0 | e3 | e3 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| 包装说明 | , | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 | PLASTIC PACKAGE-3 | - | , |
| 零件包装代码 | - | TO-92 | TO-92 | TO-92 | TO-92 | - | - |
| 针数 | - | 3 | 3 | 3 | 3 | - | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 最大集电极电流 (IC) | - | 0.5 A | 0.5 A | 0.5 A | 0.5 A | - | - |
| 集电极-发射极最大电压 | - | 30 V | 30 V | 30 V | 30 V | - | - |
| 配置 | - | SINGLE | SINGLE | SINGLE | SINGLE | - | - |
| 最小直流电流增益 (hFE) | - | 200 | 25 | 40 | 25 | - | - |
| JEDEC-95代码 | - | TO-92 | TO-92 | TO-92 | TO-92 | - | - |
| JESD-30 代码 | - | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | - | - |
| 元件数量 | - | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | - | 3 | 3 | 3 | 3 | - | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装形状 | - | ROUND | ROUND | ROUND | ROUND | - | - |
| 封装形式 | - | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | - | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 极性/信道类型 | - | NPN | NPN | NPN | NPN | - | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 表面贴装 | - | NO | NO | NO | NO | - | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 晶体管应用 | - | SWITCHING | SWITCHING | SWITCHING | SWITCHING | - | - |
| 晶体管元件材料 | - | SILICON | SILICON | SILICON | SILICON | - | - |
| 标称过渡频率 (fT) | - | 300 MHz | 300 MHz | 300 MHz | 300 MHz | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
微控制器 MCU
嵌入式系统
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