ADC, Proprietary Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, DIE-24
参数名称 | 属性值 |
厂商名称 | Signal Processing Technologies |
包装说明 | DIE-24 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 2.8 V |
最小模拟输入电压 | |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | R-XUUC-N24 |
最大线性误差 (EL) | 0.4688% |
模拟输入通道数量 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 24 |
输出位码 | BINARY |
输出格式 | PARALLEL, 8 BITS |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | RECTANGULAR |
封装形式 | UNCASED CHIP |
认证状态 | Not Qualified |
采样速率 | 30 MHz |
采样并保持/跟踪并保持 | SAMPLE |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | NO LEAD |
端子位置 | UPPER |
SPT1175ACU | SPT1175ACN | SPT1175ACP | SPT1175ACS | |
---|---|---|---|---|
描述 | ADC, Proprietary Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, DIE-24 | ADC, Proprietary Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Proprietary Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PQCC28, PLASTIC, LCC-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO24, PLASTIC, SOIC-24 |
厂商名称 | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies |
包装说明 | DIE-24 | PLASTIC, DIP-24 | PLASTIC, LCC-28 | PLASTIC, SOIC-24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
最大模拟输入电压 | 2.8 V | 2.8 V | 2.8 V | 2.8 V |
转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, FLASH METHOD |
JESD-30 代码 | R-XUUC-N24 | R-PDIP-T24 | S-PQCC-J28 | R-PDSO-G24 |
最大线性误差 (EL) | 0.4688% | 0.4688% | 0.4688% | 0.4688% |
模拟输入通道数量 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 28 | 24 |
输出位码 | BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIE | DIP | QCCJ | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | UNCASED CHIP | IN-LINE | CHIP CARRIER | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 30 MHz | 30 MHz | 30 MHz | 30 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
端子形式 | NO LEAD | THROUGH-HOLE | J BEND | GULL WING |
端子位置 | UPPER | DUAL | QUAD | DUAL |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
JESD-609代码 | - | e0 | e0 | e0 |
最高工作温度 | - | 70 °C | 70 °C | 70 °C |
封装等效代码 | - | DIP24,.3 | LDCC28,.5SQ | SOP24,.3 |
电源 | - | 5 V | 5 V | 5 V |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | - | 2.54 mm | 1.27 mm | 1.27 mm |
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