Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> HD64F2134TF20

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HD64F2134TF20: 产品描述16-BIT, FLASH, 20MHz, MICROCONTROLLER, PQFP80, PLASTIC, TQFP-80; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小4MB，共995页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HD64F2134TF20概述

16-BIT, FLASH, 20MHz, MICROCONTROLLER, PQFP80, PLASTIC, TQFP-80

HD64F2134TF20规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Renesas(瑞萨电子)
零件包装代码	QFP
包装说明	TFQFP,
针数	80
Reach Compliance Code	compliant
具有ADC	YES
地址总线宽度	16
位大小	16
最大时钟频率	20 MHz
DAC 通道	YES
DMA 通道	NO
外部数据总线宽度	8
JESD-30 代码	S-PQFP-G80
JESD-609代码	e0
长度	12 mm
I/O 线路数量	66
端子数量	80
最高工作温度	75 °C
最低工作温度	-20 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	TFQFP
封装形状	SQUARE
封装形式	FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
ROM可编程性	FLASH
座面最大高度	1.2 mm
速度	20 MHz
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL EXTENDED
端子面层	TIN LEAD
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	12 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER

文档解析

这份文档是关于Renesas Technology Corporation（瑞萨科技）的半导体产品文档，主要内容包括产品名称变更通知、公司商标、产品操作安全警告、产品材料使用注意事项、产品技术支持和客户服务信息，以及特定微控制器系列的硬件手册。以下是一些值得关注的技术信息：

产品名称变更：文档提到了从Hitachi Electric和Hitachi变更为Renesas Technology Corp.的半导体业务转移。
产品线：文档涉及的产品包括Hitachi 16-Bit Single-Chip Microcomputer系列，如H8S/2138系列、H8S/2134系列等。
安全警告：强调了在电路设计中考虑安全性的重要性，以防止使用半导体产品时可能发生的个人伤害、火灾或财产损失。
产品材料使用注意事项：提供了关于产品数据、图表、程序等使用的免责声明，以及对产品信息可能存在的技术不准确或印刷错误的提醒。
技术支持和客户服务：提供了Renesas Technology Corporation的客户支持部门联系信息，以及产品信息更新和获取的途径。
硬件手册内容：详细介绍了H8S/2138系列和H8S/2134系列微控制器的硬件特性，包括CPU核心、内部寄存器、指令集、地址空间、操作模式、中断处理、定时器、通信接口等。
微控制器特性：包括32位H8S/2000 CPU核心、16位通用寄存器、优化的指令集、线性地址空间、单电源闪存存储器（F-ZTAT™）等。
中断和定时器：文档描述了中断控制器、定时器、看门狗定时器（WDT）以及它们如何工作。
通信接口：包括串行通信接口（SCI）、IrDA、I2C总线接口等。
D/A和A/D转换器：文档提供了关于数字到模拟和模拟到数字转换器的详细信息。
电源管理：介绍了微控制器的电源模式，包括睡眠模式、软件待机模式、硬件待机模式等。
电气特性：提供了微控制器的电气规格，如电源电压、工作范围、DC特性、AC特性等。
编程和擦除注意事项：涉及Flash存储器编程和擦除的预防措施。

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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better

and more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corporation product best suited to the customer's application; they do not convey any

license under any intellectual property rights, or any other rights, belonging to Renesas Technology

Corporation or a third party.

2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any

third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corporation without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corporation

or an authorized Renesas Technology Corporation product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss

rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various

means, including the Renesas Technology Corporation Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data, diagrams,

charts, programs, and algorithms, please be sure to evaluate all information as a total system before

making a final decision on the applicability of the information and products. Renesas Technology

Corporation assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor

when considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must be

exported under a license from the Japanese government and cannot be imported into a country other

than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corporation for further details on these materials or the products

contained therein.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Preface

The H8S/2138 Series and H8S/2134 Series comprise high-performance microcomputers with a

32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system

configuration.

The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen

internal 16-bit general registers with a 32-bit configuration, and a concise and optimized

instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes).

Programs based on the high-level language C can also be run efficiently.

Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available,

providing a quick and flexible response to conditions from ramp-up through full-scale volume

production, even for applications with frequently changing specifications.

On-chip peripheral functions include a 16-bit free-running timer (FRT), 8-bit timer (TMR),

watchdog timer (WDT), two PWM timers (PWM and PWMX), a serial communication interface

(SCI, IrDA), host interface (HIF), D/A converter (DAC), A/D converter (ADC), and I/O ports. An

C bus interface (IIC) can also be incorporated as an option.

An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer

without CPU intervention.

The H8S/2138 Series has all the above on-chip supporting functions, and can also be provided

with an IIC module as an option. The H8S/2134 Series comprises reduced-function versions, with

fewer TMR channels, and no PWM, HIF, IIC, or DTC modules.

Use of the H8S/2138 or H8S/2134 Series enables compact, high-performance systems to be

implemented easily. The comprehensive PC-related interface functions and 16

8 matrix key-

scan functions are ideal for applications such as notebook PC keyboard control and intelligent

battery and power supply control, while the various timer functions and their interconnectability

(timer connection), plus the interlinked operation of the I

C bus interface and data transfer

controller (DTC), in particular, make these devices ideal for use in PC monitors. In addition, the

combination of F-ZTAT™* and reduced-function versions is ideal for applications such as system

units in which on-chip program memory is essential to meet performance requirements, product

start-up times are short, and program modifications may be necessary after end-product assembly.

This manual describes the hardware of the H8S/2138 Series and H8S/2134 Series. Refer to the

H8S/2600 Series and H8S/2000 Series Programming Manual

for a detailed description of the

instruction set.

Note: * F-ZTAT™ (Flexible-ZTAT) is a trademark of Hitachi, Ltd.

HD64F2134TF20

HD64F2134TF20概述

HD64F2134TF20规格参数

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