SN74AHC16245DLR概述

AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48, PLASTIC, SSOP-48

SN74AHC16245DLR规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	SSOP
包装说明	SSOP,
针数	48
Reach Compliance Code	unknown
系列	AHC
JESD-30 代码	R-PDSO-G48
长度	15.875 mm
逻辑集成电路类型	BUS TRANSCEIVER
位数	8
功能数量	2
端口数量	2
端子数量	48
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	SSOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH
传播延迟（tpd）	13.5 ns
认证状态	Not Qualified
座面最大高度	2.79 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.635 mm
端子位置	DUAL
宽度	7.5 mm

SN74AHC16245DLR相似产品对比

	SN74AHC16245DLR	SNJ54AHC16245WD	SN74AHC16245DGGR	SNJ54AHC16245WDR	SN74AHC16245DGVR	SN54AHC16245WDR
描述	AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48, PLASTIC, SSOP-48	AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP48, 0.380 INCH, CERAMIC, FP-48	AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48, PLASTIC, TSSOP-48	AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP48, 0.380 INCH, CERAMIC, FP-48	AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48, PLASTIC, TVSOP-48	AHC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP48, 0.380 INCH, CERAMIC, FP-48
零件包装代码	SSOP	DFP	TSSOP	DFP	SOIC	DFP
包装说明	SSOP,	DFP, FL48,.4,25	TSSOP, TSSOP48,.3,20	DFP,	TSSOP, TSSOP48,.25,16	DFP,
针数	48	48	48	48	48	48
Reach Compliance Code	unknown	not_compliant	not_compliant	unknown	not_compliant	unknown
系列	AHC	AHC	AHC	AHC	AHC	AHC
JESD-30 代码	R-PDSO-G48	R-GDFP-F48	R-PDSO-G48	R-GDFP-F48	R-PDSO-G48	R-GDFP-F48
长度	15.875 mm	15.748 mm	12.5 mm	15.748 mm	9.7 mm	15.748 mm
逻辑集成电路类型	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER
位数	8	8	8	8	8	8
功能数量	2	2	2	2	2	2
端口数量	2	2	2	2	2	2
端子数量	48	48	48	48	48	48
最高工作温度	85 °C	125 °C	85 °C	125 °C	85 °C	125 °C
最低工作温度	-40 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
封装代码	SSOP	DFP	TSSOP	DFP	TSSOP	DFP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH	FLATPACK	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	FLATPACK	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	FLATPACK
传播延迟（tpd）	13.5 ns	13.5 ns	13.5 ns	13.5 ns	13.5 ns	13.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.79 mm	3.05 mm	1.2 mm	3.05 mm	1.2 mm	3.05 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY
端子形式	GULL WING	FLAT	GULL WING	FLAT	GULL WING	FLAT
端子节距	0.635 mm	0.635 mm	0.5 mm	0.635 mm	0.4 mm	0.635 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	7.5 mm	9.652 mm	6.1 mm	9.652 mm	4.4 mm	9.652 mm
厂商名称	Texas Instruments(德州仪器)	-	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)

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