Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 60 dB |
| 通态电阻匹配规范 | 36 Ω |
| 最大通态电阻 (Ron) | 350 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 最大信号电流 | 0.02 A |
| 最大供电电流 (Isup) | 1 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| IH6108CJE | IH6108MJE/883B | IH6108CPE | IH6108MJE | |
|---|---|---|---|---|
| 描述 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16, CERDIP-16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 60 dB | 60 dB | 60 dB | 60 dB |
| 通态电阻匹配规范 | 36 Ω | 60 Ω | 36 Ω | 36 Ω |
| 最大通态电阻 (Ron) | 350 Ω | 300 Ω | 350 Ω | 300 Ω |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大信号电流 | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| 最大供电电流 (Isup) | 1 mA | 0.2 mA | 1 mA | 0.2 mA |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | Harris | - | Harris | Harris |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
