IH5145MJE在线购买

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IH5145MJE概述

DPST, 2 Func, 2 Channel, CMOS, CDIP16, CERAMIC, DIP-16

IH5145MJE规格参数

参数名称	属性值
厂商名称	Rochester Electronics
包装说明	DIP,
Reach Compliance Code	unknown
模拟集成电路 - 其他类型	DPST
JESD-30 代码	R-GDIP-T16
标称负供电电压 (Vsup)	-15 V
信道数量	2
功能数量	2
端子数量	16
标称断态隔离度	54 dB
通态电阻匹配规范	25 Ω
最大通态电阻 (Ron)	50 Ω
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
标称供电电压 (Vsup)	15 V
表面贴装	NO
最长断开时间	125 ns
最长接通时间	200 ns
技术	CMOS
温度等级	MILITARY
端子形式	THROUGH-HOLE
端子位置	DUAL

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IH5145MJE相似产品对比

	IH5145MJE	IH5141MJE/883B	IH5140MJE/883B	IH5142MJE/883B	IH5141CJE	IH5141CPE	IH5141MJE	IH5142MJE	IH5143MJE
描述	DPST, 2 Func, 2 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPST, 2 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPST, 1 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPDT, 1 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPST, 2 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPST, 2 Func, 1 Channel, CMOS, PDIP16, PLASTIC, DIP-16	SPST, 2 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPDT, 1 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16	SPDT, 2 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
包装说明	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
模拟集成电路 - 其他类型	DPST	SPST	SPST	SPDT	SPST	SPST	SPST	SPDT	SPDT
JESD-30 代码	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-PDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16
标称负供电电压 (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
信道数量	2	1	1	1	1	1	1	1	1
功能数量	2	2	1	1	2	2	2	1	2
端子数量	16	16	16	16	16	16	16	16	16
标称断态隔离度	54 dB	54 dB	54 dB	54 dB	50 dB	50 dB	54 dB	54 dB	54 dB
通态电阻匹配规范	25 Ω	25 Ω	25 Ω	25 Ω	30 Ω	30 Ω	25 Ω	25 Ω	25 Ω
最大通态电阻 (Ron)	50 Ω	50 Ω	50 Ω	50 Ω	75 Ω	75 Ω	50 Ω	50 Ω	50 Ω
最高工作温度	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
标称供电电压 (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO
最长断开时间	125 ns	125 ns	125 ns	125 ns	150 ns	150 ns	125 ns	125 ns	125 ns
最长接通时间	200 ns	150 ns	150 ns	200 ns	175 ns	175 ns	150 ns	200 ns	200 ns
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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