Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20
| 参数名称 | 属性值 |
| 厂商名称 | Harris |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 其他特性 | COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | HCT |
| JESD-30 代码 | R-CDFP-F20 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟(tpd) | 43 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| HCTS299KMSH | 5962R9574601VRX | 5962R9574601VXX | HCTS299DMSH | |
|---|---|---|---|---|
| 描述 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-CDFP-F20 | R-CDIP-T20 | R-CDFP-F20 | R-CDIP-T20 |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| 传播延迟(tpd) | 43 ns | 34 ns | 34 ns | 43 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
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