ADC, Successive Approximation, 8-Bit, 1 Func, Serial, Parallel, 8 Bits Access, Hybrid, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Spectrum Microwave |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.6 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 25 V |
| 最小模拟输入电压 | -25 V |
| 最长转换时间 | 1 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-CDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 32.893 mm |
| 最大线性误差 (EL) | 0.2% |
| 标称负供电电压 | -15 V |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL, PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,+-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.207 mm |
| 最大压摆率 | 100 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| MN5825 | MN5825H | MN5825H/BCH | MN5825H/B | MN5825E | |
|---|---|---|---|---|---|
| 描述 | ADC, Successive Approximation, 8-Bit, 1 Func, Serial, Parallel, 8 Bits Access, Hybrid, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | ADC, Successive Approximation, 8-Bit, 1 Func, Serial, Parallel, 8 Bits Access, Hybrid, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | ADC, Successive Approximation, 8-Bit, 1 Func, Serial, Parallel, 8 Bits Access, Hybrid, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | ADC, Successive Approximation, 8-Bit, 1 Func, Serial, Parallel, 8 Bits Access, Hybrid, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | ADC, Successive Approximation, 8-Bit, 1 Func, Serial, Parallel, 8 Bits Access, Hybrid, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 |
| 最大模拟输入电压 | 25 V | 25 V | 25 V | 25 V | 25 V |
| 最小模拟输入电压 | -25 V | -25 V | -25 V | -25 V | -25 V |
| 最长转换时间 | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 32.893 mm | 32.893 mm | 32.893 mm | 32.893 mm | 32.893 mm |
| 最大线性误差 (EL) | 0.2% | 0.2% | 0.2% | 0.2% | 0.2% |
| 标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -25 °C |
| 输出位码 | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.207 mm | 5.207 mm | 5.207 mm | 5.207 mm | 5.207 mm |
| 最大压摆率 | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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