D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, CQCC28,
参数名称 | 属性值 |
厂商名称 | Micro Power Systems |
Reach Compliance Code | unknown |
最大模拟输出电压 | 12 V |
最小模拟输出电压 | |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | PARALLEL, 8 BITS |
JESD-30 代码 | S-PQCC-J28 |
最大线性误差 (EL) | 0.391% |
标称负供电电压 | -5 V |
位数 | 8 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
认证状态 | Not Qualified |
最大稳定时间 | 4 µs |
最大压摆率 | 16 mA |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子形式 | J BEND |
端子位置 | QUAD |
MP7228KP | MP7228KN | MP7228UD | MP7228LN | MP7228LP | MP7228TD | |
---|---|---|---|---|---|---|
描述 | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, CQCC28, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, PDIP24, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, PDIP24, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, PDIP24, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, CQCC28, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, PDIP24, |
厂商名称 | Micro Power Systems | Micro Power Systems | Micro Power Systems | Micro Power Systems | Micro Power Systems | Micro Power Systems |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最大模拟输出电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
JESD-30 代码 | S-PQCC-J28 | R-PDIP-T24 | R-GDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | R-GDIP-T24 |
最大线性误差 (EL) | 0.391% | 0.391% | 0.195% | 0.195% | 0.195% | 0.391% |
标称负供电电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
位数 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 24 | 24 | 24 | 28 | 24 |
最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大稳定时间 | 4 µs | 4 µs | 4 µs | 4 µs | 4 µs | 4 µs |
最大压摆率 | 16 mA | 16 mA | 16 mA | 16 mA | 16 mA | 16 mA |
表面贴装 | YES | NO | NO | NO | YES | NO |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
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