The documentation and process conversion measures
necessary to comply with this document shall be
completed by 16 May 2013.
INCH-POUND
MIL-PRF-19500/291U
16 February 2013
SUPERSEDING
MIL-PRF-19500/291T
23 September 2011
PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, SWITCHING,
TYPES 2N2906A, 2N2906AL, 2N2907A, 2N2907AL, 2N2906AUA,
2N2907AUA, 2N2906AUB, 2N2906AUBC, 2N2907AUB, 2N2907AUBC,
2N2906AUBN, 2N2906AUBCN, 2N2907AUBN, AND 2N2907AUBCN, JAN,
JANTX, JANTXV, JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANSF,
JANSG, JANSH JANHC, JANKC, JANKCM, JANKCD,
JANKCP, JANKCL, JANKCR, JANKCF, JANKCG, AND JANKCH
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for PNP, silicon, switching transistors. Five
levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two
levels of product assurance are provided for each unencapsulated device type. Radiation hardness assurance (RHA)
level designators “M”, “D”, “P“, “L” “R”, “F’, “G”, and “H” are appended to the device prefix to identify devices which
have passed RHA requirements.
* 1.2 Physical dimensions. See
figure 1
(similar to a TO-18), figure 2, (surface mount case outlines UA, figure 3
UB (metal lid, as shield, connected to fourth pad), UBC (ceramic lid, braze-ring connected to fourth pad), UBN (3-pin,
isolated metal lid), and UBCN (3-pin, isolated ceramic lid) and figures 4, and 5 (JANHC and JANKC).
1.3 Maximum ratings. Unless otherwise specified T
A
= +25°C.
Types
I
C
mA dc
All devices
600
V
CBO
V dc
60
V
EBO
V dc
5
V
CEO
V dc
60
T
J
and T
STG
°C
-65 to +200
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dla.mil.
Since contact
information can change, you may want to verify the currency of this address information using the ASSIST Online
database at
https://assist.dla.mil
.
AMSC N/A
FSC 5961
MIL-PRF-19500/291U
1.3
Maximum ratings. Unless otherwise specified T
A
= +25°C. - Continued.
Types
P
T
T
A
= +25°C
(1) (2)
W
2N2906A, L,
2N2907A, L
2N2906AUA,
2N2907AUA
2N2906AUB,
and UBN
2N2907AUB
and UBN
2N2906AUBC
and UBCN
2N2907AUBC
and UBCN
0.5
0.5
(4) 0.5
(4) 0.5
(4)0.5
(4) 0.5
(4) 0.5
(4) 0.5
P
T
T
C
= +25°C
(1) (2)
W
1.0
1.0
N/A
N/A
N/A
N/A
N/A
N/A
P
T
T
SP(IS)
= +25°C
(1) (2)
W
N/A
N/A
1.0
1.0
1.0
1.0
1.0
1.0
P
T
T
SP(AM)
=
+25°C (1) (2)
W
N/A
N/A
1.5
1.5
N/A
N/A
N/A
N/A
R
θ
JA
(2) (3)
°C/W
325
325
(4) 325
(4) 325
(4) 325
(4) 325
(4) 325
(4) 325
R
θ
JC
(2)
(3)
°C/W
150
150
N/A
N/A
N/A
N/A
N/A
N/A
R
θ
JSP(IS)
(2) (3)
°C/W
N/A
N/A
110
110
90
90
90
90
R
θJSP(AM)
(2) (3)
°C/W
N/A
N/A
40
40
N/A
N/A
N/A
N/A
(1)
(2)
(3)
(4)
For derating, see figures 6, 7, 8, 9, and 10.
See 3.3 for abbreviations.
For thermal curves, see figures 11, 12, 13, 14, and 15.
For non-thermal conductive PCB or unknown PCB surface mount conditions in free air, substitute figures 6
and 11 for the UA, UB,, UBC, UBN, and UBCN package and use R
θ
JA
.
1.4 Primary electrical characteristics. Unless otherwise specified T
A
= +25°C.
h
FE
at V
CE
= 10 V dc
h
FE3
I
C
= 10 mA dc
h
FE1
I
C
= 0.1 mA dc
h
FE2
I
C
= 1.0 mA dc
h
FE4
(1)
I
C
= 150 mA dc
h
FE5
(1)
I
C
= 500 mA dc
2N2906A, 2N2907A, 2N2906A 2N2907A 2N2906A 2N2907A 2N2906A 2N2907A 2N2906A 2N2907A L,
L, UA,UB, L, UA,UB, , L, UA,UB, L, UA,UB, L, UA,UB, L, UA,UB, L, UA,UB, L, UA,UB, L, UA,UB,
UA,UB,
UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN, UBC, UBN,
UBCN
UBCN
UBCN
UBCN
UBCN
UBCN
UBCN
UBCN
UBCN
UBCN
Min
40
75
40
100
40
100
40
100
40
50
Max
175
450
120
300
Switching (saturated)
t
on
t
off
See
figure 16
See
figure 17
ns
ns
Types
Limit
|h
fe
|
f = 100 MHz V
CE
= 20 V dc,
I
C
= 20 mA dc
C
obo
100 kHz
≤
f
≤
1 MHz
V
CB
= 10 V dc, I
E
= 0
pF
2N2906A,
2N2907A,
L, UA, UB, UBC,
UBN, UBCN
Min
Max
2.0
8
45
300
Types
Limits
V
CE(sat)1
(1)
I
C
= 150 mA dc
I
B
= 15 mA dc
V dc
V
CE(sat)2
(1)
I
C
= 500 mA dc
I
B
= 50 mA dc
V dc
1.6
V
BE(sat)1
(1)
I
C
= 150 mA dc
I
B
= 15 mA dc
V dc
0.6
1.3
V
BE(sat)2
(1)
I
C
= 500 mA dc
I
B
= 50 mA dc
V dc
2.6
2N2906A, 2N2907A,
L, UA, UB, UBC
UBN, UBCN
Min
Max
0.4
(1) Pulsed see
4.5.1.
2
MIL-PRF-19500/291U
Symbol
Inches
Min
CD
CH
HD
LC
LD
LL
LU
L
1
L
2
P
Q
TL
TW
r
α
.028
.036
.250
.100
.178
.170
.209
Dimensions
Millimeters
Min
4.52
4.32
5.31
Max
4.95
5.33
5.84
Notes
Max
.195
.210
.230
.100 TP
.016
.500
.016
.021
.750
.019
.050
2.54 TP
0.41
12.70
0.41
0.53
19.05
0.48
1.27
6.35
2.54
6
7,8
7,8,13
7,8
7,8
7,8
.030
.048
.046
.010
45° TP
0.71
0.91
0.76
1.22
1.17
0.25
45° TP
5
3,4
3
10
6
NOTES:
1. Dimension are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 inch (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within
.007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at
MMC.
7. Dimension LU applies between L
1
and L
2
. Dimension LD applies between L
2
and LL minimum. Diameter
is uncontrolled in L
1
and beyond LL minimum.
8. All three leads.
9. The collector shall be internally connected to the case.
10. Dimension r (radius) applies to both inside corners of tab.
11. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min. and 1.75 inches (44.45 mm) max.
FIGURE 1. Physical dimensions (similar to TO-18).
3
MIL-PRF-19500/291U
UA
Symbol
BL
BL2
BW
BW2
CH
L3
LH
LL1
LL2
LS
LW
LW2
*
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.215
.225
5.46
5.71
.225
5.71
.145
.155
3.68
3.93
.155
3.93
.061
.075
1.55
1.90
.003
0.08
.029
.042
0.74
1.07
.032
.048
0.81
1.22
.072
.088
1.83
2.23
.045
.055
1.14
1.39
.022
.028
0.56
0.71
.006
.022
0.15
0.56
1
Collector
2
Emitter
3
Base
Note
3
5
5
4
N/C
Pin no.
Transistor
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimension "CH" controls the overall package thickness. When a window lid is used, dimension "CH" must
increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).
4. The corner shape (square, notch, radius) may vary at the manufacturer's option, from that shown on the
drawing.
5. Dimensions "LW2" minimum and "L3" minimum and the appropriate castellation length define an unobstructed
three-dimensional space traversing all of the ceramic layers in which a castellation was designed.
(Castellations are required on bottom two layers, optional on top ceramic layer.) Dimension "LW2" maximum
and "L3" maximum define the maximum width and depth of the castellation at any point on its surface.
Measurement of these dimensions may be made prior to solder dipping.
6. The coplanarity deviation of all terminal contact points, as defined by the device seating plane, shall not
exceed .006 inch (0.15 mm) for solder dipped leadless chip carriers.
7. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
* FIGURE 2. Physical dimensions, surface mount (UA version).
4
MIL-PRF-19500/291U
* FIGURE 3. Physical dimensions, surface mount (UB, UBN, UBC, and UBCN versions).
5
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