1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications
SSTUA32866 | SSTUA32866EC | SSTUA32866EC/G | |
---|---|---|---|
描述 | 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications | 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications | 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications |
是否Rohs认证 | - | 不符合 | 符合 |
零件包装代码 | - | BGA | BGA |
包装说明 | - | LFBGA, BGA96,6X16,32 | LFBGA, BGA96,6X16,32 |
针数 | - | 96 | 96 |
制造商包装代码 | - | SOT-536-1 | SOT-536-1 |
Reach Compliance Code | - | unknow | unknow |
系列 | - | 32866 | 32866 |
JESD-30 代码 | - | R-PBGA-B96 | R-PBGA-B96 |
长度 | - | 13.5 mm | 13.5 mm |
逻辑集成电路类型 | - | D FLIP-FLOP | D FLIP-FLOP |
位数 | - | 14 | 14 |
功能数量 | - | 1 | 1 |
端子数量 | - | 96 | 96 |
最高工作温度 | - | 70 °C | 70 °C |
输出特性 | - | OPEN-DRAIN | OPEN-DRAIN |
输出极性 | - | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | LFBGA | LFBGA |
封装等效代码 | - | BGA96,6X16,32 | BGA96,6X16,32 |
封装形状 | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | 260 |
电源 | - | 1.8 V | 1.8 V |
传播延迟(tpd) | - | 1.8 ns | 1.8 ns |
认证状态 | - | Not Qualified | Not Qualified |
座面最大高度 | - | 1.5 mm | 1.5 mm |
最大供电电压 (Vsup) | - | 2 V | 2 V |
最小供电电压 (Vsup) | - | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | - | 1.8 V | 1.8 V |
表面贴装 | - | YES | YES |
技术 | - | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL |
端子形式 | - | BALL | BALL |
端子节距 | - | 0.8 mm | 0.8 mm |
端子位置 | - | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 40 |
触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE |
宽度 | - | 5.5 mm | 5.5 mm |
最小 fmax | - | 450 MHz | 450 MHz |
Base Number Matches | - | 1 | 1 |
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