SPECIALTY INTERFACE CIRCUIT, PDSO8
专业接口电路, PDSO8
参数名称 | 属性值 |
功能数量 | 2 |
端子数量 | 8 |
最大工作温度 | 85 Cel |
最小工作温度 | -40 Cel |
最小供电电压1 | 1 V |
加工封装描述 | 2.30 MM WIDTH, PLASTIC, MO-187, SOT765-1, VSSOP-8 |
无铅 | Yes |
欧盟RoHS规范 | Yes |
中国RoHS规范 | Yes |
状态 | ACTIVE |
包装形状 | RECTANGULAR |
包装尺寸 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
表面贴装 | Yes |
端子形式 | GULL WING |
端子间距 | 0.5000 mm |
端子涂层 | NOT SPECIFIED |
端子位置 | DUAL |
包装材料 | PLASTIC/EPOXY |
温度等级 | INDUSTRIAL |
接口类型 | INTERFACE CIRCUIT |
PCA9306 | PCA9306DC | PCA9306DP | PCA9306D | PCA9306GD1 | PCA9306GM | PCA9306_10 | PCA9306GF | |
---|---|---|---|---|---|---|---|---|
描述 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 | SPECIALTY INTERFACE CIRCUIT, PDSO8 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
表面贴装 | Yes | YES | YES | YES | YES | YES | Yes | YES |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 |
厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
零件包装代码 | - | TSSOP | SOIC | SOIC | SON | QFN | - | SON |
包装说明 | - | VSSOP, TSSOP8,.12,20 | TSSOP, TSSOP8,.25 | 3.90 MM WIDTH, PLASTIC, MS-012, SOT96-1, SOP-8 | VSON, | QCCN, LCC8,.06SQ,20 | - | VSON, |
针数 | - | 8 | 8 | 8 | 8 | 8 | - | 8 |
Reach Compliance Code | - | compli | compli | compli | unknow | compli | - | compli |
接口集成电路类型 | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT |
JESD-30 代码 | - | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | S-PQCC-N8 | - | R-PDSO-N8 |
长度 | - | 2.3 mm | 3 mm | 4.9 mm | 3 mm | 1.6 mm | - | 1.35 mm |
湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | - | 1 |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | - | VSSOP | TSSOP | SOP | VSON | QCCN | - | VSON |
封装形状 | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | - | RECTANGULAR |
封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER | - | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 | 260 | - | 260 |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
座面最大高度 | - | 1 mm | 1.1 mm | 1.75 mm | 0.5 mm | 0.5 mm | - | 0.5 mm |
最小供电电压 | - | 1 V | 1 V | 1 V | 1 V | 1 V | - | - |
端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Pure Tin (Sn) |
端子节距 | - | 0.5 mm | 0.65 mm | 1.27 mm | 0.5 mm | 0.55 mm | - | 0.35 mm |
处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 | 30 | - | 30 |
宽度 | - | 2 mm | 3 mm | 3.9 mm | 2 mm | 1.6 mm | - | 1 mm |
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