电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDSM4-400L4A8-0.5

产品描述400 CONTACT(S), MALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, PLUG
产品类别连接器    连接器   
文件大小303KB,共4页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
下载文档 详细参数 全文预览

HDSM4-400L4A8-0.5概述

400 CONTACT(S), MALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, PLUG

HDSM4-400L4A8-0.5规格参数

参数名称属性值
厂商名称TE Connectivity(泰科)
Reach Compliance Codeunknown
其他特性STANDRD: MIL-DTL-83513, POLARISED
主体/外壳类型PLUG
连接器类型TELECOM AND DATACOM CONNECTOR
联系完成配合GOLD (50) OVER COPPER
联系完成终止GOLD (50) OVER COPPER
触点性别MALE
DIN 符合性NO
空壳NO
滤波功能NO
IEC 符合性NO
绝缘体材料LIQUID CRYSTAL POLYMER
JESD-609代码e4
MIL 符合性YES
制造商序列号HDSM
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD AND PANEL
选件GENERAL PURPOSE
外壳面层NICKEL
外壳材料ALUMINUM ALLOY
端接类型SOLDER
触点总数400

文档预览

下载PDF文档
Rectangular Connectors
High Density Standard Module (HDSM) Connectors
Features
I
Designed for surface
mounting on both daughter
board and mother board for
increased circuit density
Basic design offers 38, 78,
120, 152, 200, 304, and 400
contact designs
High reliability twist pin and
socket per MIL-DTL-83513
and MIL-DTL-55302
Connector permits lateral
movement of daughter
board to accommodate
clamping of the heatsink
Plated through-hole
mounting available
Available with flying leads
Extender card option
available
Typical mating force for 304
contacts is 38 pounds
Designed to withstand vapor
phase soldering
Two rotatable (six position)
polarizing keys are provided
accommodating 36 possible
combinations
Jackscrew hardware
available; consult
Tyco Electronics
Different modular inserts
may be specified to include
coax (Pixi/Con), fiber optic
or other special contacts
Inserts may be partially or
fully loaded and installed in
the connector shell in
various configurations
The MICRODOT HDSM
connector is designed for
4 row .050 [1.27] pitch
density with a special low
force twist pin that meets
all requirements of MIL-
DTL-55302 and MIL-DTL-
83513. This high density
connector allows the use of
construction to double the
packaging density with
surface mount capability.
I
I
I
Rectangular
Connectors
I
I
I
I
I
I
2
I
I
Performance Data Summary
Electrical
Contacts
— Pin 24 AWG twist pin,
Socket #24 AWG, Wire range 24 AWG to
32 AWG solid and stranded.
Contact Resistance (voltage drop)
25 millivolts max. at 3 amps, 25° ± 3° C.
Current Rating
— 3 amps max. per
contact
Dielectric Withstanding Voltage
Volts RMS 60 Hz at room ambient:
600 V for solder pots at sea level.
150 V for solder pots at 70,000 ft.
[21,336m]
500 V for wire terminations at sea level.
200 V for wire terminations at 70,000 ft.
Insulation Resistance
— 5,000
megohms min. at room ambient.
Magnetic Permeability
— 2 mµ max.
Materials and Finishes
Contacts
— Copper alloy plated with
.000050 [0.00127] gold over copper
flash per MIL-G-45204, Type II.
Metal Shell
Insulator — Liquid Crystal Polymer
(LCP) per ASTM D5138 or
Polyphenylene Sulfide per
MIL-M-24519
Body Shell — Aluminum alloy plated
Nickel, electroless per MIL-C-26074.
I
Environmental
Temperature Range
-67°F to 257°F [-55° C to +125° C].
Vibration
— No discontinuity in
excess of 1 micro sec. when tested in
accordance with MIL-STD-1344,
Method 2005, test Condition IV.
Insulator Retention
— Inserts will
withstand a 50 lb. per square inch load
in either direction.
Shock
— No discontinuity in excess of
1 micro sec. when tested in accordance
with MIL-STD-1344, Method 2004, test
Condition E.
Mechanical
Contact Spacing
— .050 [1.27] centers
Contact Engagement &
Separation
— 5.0 oz max. [1.39N]
(eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
[.97N] (sep.) force.
Durability
— No mechanical or electri-
cal defects detrimental to the function of
the connectors after 500 cycles of mat-
ing and unmating. (Caution: Mating
force increases during durability cycling
may be noted).
Humidity
— After exposure to humidi-
ty as specified by MIL-STD-1344,
Method 1002, Type II, IR shall be 1
megohm min. immediately following
step 7a of Method 1002 and 1000
megohms min. after 24 hours of condi-
tioning per Method 1002.
Salt Spray
— Connectors shall meet
the performance requirements of contact
resistance, mating and unmating forces,
and contact retention after being subject-
ed to the 48-hour 5% solution salt spray
test per MIL-STD-1344, Method 1001,
Condition B.
Crimp Termination Tensile
Strength
— *Unassembled contacts
with crimped stranded wire terminations.
Wires will not pull out of contacts when
the following axial loads are applied:
24 AWG, 5 lbs., 26 AWG, 4 lbs.,
28 AWG, 3 lbs.
51
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
关注TE赢三星手机了解绿色汽车——新能源汽车解决方案
汽车正在实现互联,即我们说的汽车之间的通信,从而能够真正的实现各种安全应用,如附近发生了交通堵塞,那里的汽车将给你的汽车传送这条消息,你就可以减速慢行或选择其他线路了:) 17 ......
eric_wang 汽车电子
发现TI LM4F232硬件库还有软件库函数有错误
这是库函数,因为这个错误让我找了好久。 //***************************************************************************** // //! Sends an address character from the specified port ......
0nline 微控制器 MCU
方型过孔问题
本人有个器件是方型插针,靠的比较近有园过孔不行,需要用扁平过孔,不知道各位大侠有知道的么?请教...
liangqiubin PCB设计
CCSV5.5安装不了,怎么破?
W8系统,每次安装到一半就卡在这,我已经把所有的杀毒软件删了,防火墙之类的也禁了,依旧装不了,求大神看看怎么解决这个问题、、、{:1_85:} ...
lyf92 微控制器 MCU
R7F0C80212 使用心得(初级篇)
本帖最后由 weizhongc 于 2014-8-7 16:52 编辑 {:1_145:}8月1号,收到开发板,感觉自己挺幸运的,只不过搭建环境,到硬件仿真整个过程真囧啊。 记得12年还 ......
weizhongc 瑞萨MCU/MPU
gratuate
26299...
15075018luerdu 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1808  2676  85  2799  2752  3  41  52  35  50 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved