D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDSO16, TTP-16DA
参数名称 | 属性值 |
厂商名称 | Hitachi (Renesas ) |
零件包装代码 | SOIC |
包装说明 | TSSOP, |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | HC/UH |
JESD-30 代码 | R-PDSO-G16 |
长度 | 5 mm |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 6 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 200 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
宽度 | 4.4 mm |
HD74HC174T-EL | HD74HC174FP-EL | HD74HC174P | HD74HC174RP | HD74HC174RP-EL | HD74HC174T | |
---|---|---|---|---|---|---|
描述 | D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDSO16, TTP-16DA | D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDSO16, FP-16DA | D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDIP16, DP-16 | D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDSO16, FP-16DN | D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDSO16, FP-16DN | D Flip-Flop, HC/UH Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, CMOS, PDSO16, TTP-16DA |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | SOIC | SOIC | DIP | SOIC | SOIC | SOIC |
包装说明 | TSSOP, | SOP, | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, | TSSOP, TSSOP16,.25 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
长度 | 5 mm | 10.06 mm | 19.2 mm | 9.9 mm | 9.9 mm | 5 mm |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 6 | 6 | 6 | 6 | 6 | 6 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SOP | DIP | SOP | SOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 2.2 mm | 5.06 mm | 1.75 mm | 1.75 mm | 1.1 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | YES | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 4.4 mm | 5.5 mm | 7.62 mm | 3.95 mm | 3.95 mm | 4.4 mm |
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