Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32
参数名称 | 属性值 |
厂商名称 | Connor-Winfield |
零件包装代码 | MODULE |
包装说明 | , |
针数 | 32 |
Reach Compliance Code | unknown |
应用程序 | SONET;SDH |
JESD-30 代码 | R-XDMA-T32 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
标称供电电压 | 3.3 V |
表面贴装 | NO |
电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
SM3-8R-077.76M | SM3-8R-012.96M | SM3-8R-019.44M | SM3-8R-025.92M | SM3-8R-038.88M | SM3-8R-051.84M | |
---|---|---|---|---|---|---|
描述 | Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32 | Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32 | Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32 | Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32 | Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32 | Support Circuit, 1-Func, 2.050 X 1.250 INCH, 0.515 INCH HEIGHT, ROHS COMPLIANT, MODULE-32 |
厂商名称 | Connor-Winfield | Connor-Winfield | Connor-Winfield | Connor-Winfield | Connor-Winfield | Connor-Winfield |
零件包装代码 | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
针数 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
应用程序 | SONET;SDH | SONET;SDH | SONET;SDH | SONET;SDH | SONET;SDH | SONET;SDH |
JESD-30 代码 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 | R-XDMA-T32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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