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SN74LVC1G27
SINGLE 3-INPUT POSITIVE-NOR GATE
www.ti.com
SCES488C – SEPTEMBER 2003 – REVISED SEPTEMBER 2006
FEATURES
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 4.5 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
DBV PACKAGE
(TOP VIEW)
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
A
GND
B
1
6
C
V
CC
Y
A
GND
1
2
3
6
5
4
C
V
CC
Y
B
GND
A
3 4
2 5
1 6
Y
V
CC
C
2
5
B
3
4
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G27 performs the Boolean function Y = A + B + C or Y = A
⋅
B
⋅
C in positive logic.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
(1)
(2)
Reel of 3000
SN74LVC1G27YZPR
Reel of 3000
Reel of 3000
SN74LVC1G27DBVR
SN74LVC1G27DCKR
C27_
CU_
ORDERABLE PART NUMBER
SN74LVC1G27YEPR
_ _ _CU_
TOP-SIDE MARKING
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2006, Texas Instruments Incorporated
SN74LVC1G27
SINGLE 3-INPUT POSITIVE-NOR GATE
SCES488C – SEPTEMBER 2003 – REVISED SEPTEMBER 2006
www.ti.com
FUNCTION TABLE
INPUTS
A
H
X
X
L
B
X
H
X
L
C
X
X
H
L
OUTPUT
Y
L
L
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)
A
B
C
Y
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
I
V
O
V
O
I
IK
I
OK
I
O
Supply voltage range
Input voltage range
(2)
Voltage range applied to any output in the high-impedance or power-off
Voltage range applied to any output in the high or low state
(2) (3)
Input clamp current
Output clamp current
Continuous output current
Continuous current through V
CC
or GND
DBV package
θ
JA
T
stg
(1)
(2)
(3)
(4)
Package thermal impedance
(4)
Storage temperature range
DCK package
YEP/YZP package
–65
V
I
< 0
V
O
< 0
state
(2)
–0.5
–0.5
–0.5
–0.5
MAX
6.5
6.5
6.5
V
CC
+ 0.5
–50
–50
±50
±100
165
259
123
150
°C
°C/W
UNIT
V
V
V
V
mA
mA
mA
mA
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of V
CC
is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SN74LVC1G27
SINGLE 3-INPUT POSITIVE-NOR GATE
SCES488C – SEPTEMBER 2003 – REVISED SEPTEMBER 2006
Recommended Operating Conditions
(1)
MIN
V
CC
Supply voltage
Operating
Data retention only
V
CC
= 1.65 V to 1.95 V
V
IH
High-level input voltage
V
CC
= 2.3 V to 2.7 V
V
CC
= 3 V to 3.6 V
V
CC
= 4.5 V to 5.5 V
V
CC
= 1.65 V to 1.95 V
V
IL
Low-level input voltage
V
CC
= 2.3 V to 2.7 V
V
CC
= 3 V to 3.6 V
V
CC
= 4.5 V to 5.5 V
V
I
V
O
Input voltage
Output voltage
V
CC
= 1.65 V
V
CC
= 2.3 V
I
OH
High-level output current
V
CC
= 3 V
V
CC
= 4.5 V
V
CC
= 1.65 V
V
CC
= 2.3 V
I
OL
Low-level output current
V
CC
= 3 V
V
CC
= 4.5 V
V
CC
= 1.8 V
±
0.15 V, 2.5 V
±
0.2 V
∆t/∆v
T
A
(1)
Input transition rise or fall rate
Operating free-air temperature
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5 V
±
0.5 V
–40
0
0
1.65
1.5
0.65
×
V
CC
1.7
2
0.7
×
V
CC
0.35
×
V
CC
0.7
0.8
0.3
×
V
CC
5.5
V
CC
–4
–8
–16
–24
–32
4
8
16
24
32
20
10
10
85
°C
ns/V
mA
mA
V
V
V
V
MAX
5.5
UNIT
V
All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs,
literature number SCBA004.
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3
SN74LVC1G27
SINGLE 3-INPUT POSITIVE-NOR GATE
SCES488C – SEPTEMBER 2003 – REVISED SEPTEMBER 2006
www.ti.com
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
I
OH
= –100
µA
I
OH
= –4 mA
V
OH
I
OH
= –8 mA
I
OH
= –16 mA
I
OH
= –24 mA
I
OH
= –32 mA
I
OL
= 100
µA
I
OL
= 4 mA
V
OL
I
OL
= 8 mA
I
OL
= 16 mA
I
OL
= 24 mA
I
OL
= 32 mA
I
I
I
off
I
CC
∆I
CC
C
i
(1)
All inputs
V
I
= 5.5 V or GND
V
I
or V
O
= 5.5 V
V
I
= 5.5 V or GND,
One input at V
CC
– 0.6 V,
V
I
= V
CC
or GND
All typical values are at V
CC
= 3.3 V, T
A
= 25°C.
I
O
= 0
Other inputs at V
CC
or GND
TEST CONDITIONS
V
CC
1.65 V to 5.5 V
1.65 V
2.3 V
3V
4.5 V
1.65 V to 5.5 V
1.65 V
2.3 V
3V
4.5 V
0 to 5.5 V
0
1.65 V to 5.5 V
3 V to 5.5 V
3.3 V
3.5
MIN
V
CC
– 0.1
1.2
1.9
2.4
2.3
3.8
0.1
0.45
0.3
0.4
0.55
0.55
±5
±10
10
500
µA
µA
µA
µA
pF
V
V
TYP
(1)
MAX
UNIT
Switching Characteristics
over recommended operating free-air temperature range, C
L
= 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
t
pd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
V
CC
= 1.8 V
±
0.15 V
MIN
2
MAX
18.2
V
CC
= 2.5 V
±
0.2 V
MIN
1.2
MAX
6.2
V
CC
= 3.3 V
±
0.3 V
MIN
1
MAX
4.5
V
CC
= 5 V
±
0.5 V
MIN
0.8
MAX
3.1
ns
UNIT
Switching Characteristics
over recommended operating free-air temperature range, C
L
= 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
PARAMETER
t
pd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
V
CC
= 1.8 V
±
0.15 V
MIN
2.2
MAX
20.5
V
CC
= 2.5 V
±
0.2 V
MIN
1.4
MAX
7.1
V
CC
= 3.3 V
±
0.3 V
MIN
1.3
MAX
5.4
V
CC
= 5 V
±
0.5 V
MIN
1
MAX
3.6
ns
UNIT
Operating Characteristics
T
A
= 25°C
PARAMETER
C
pd
Power dissipation capacitance
TEST
CONDITIONS
f = 10 MHz
V
CC
= 1.8 V
TYP
17
V
CC
= 2.5 V
TYP
18
V
CC
= 3.3 V
TYP
19
V
CC
= 5 V
TYP
22
UNIT
pF
4
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