4-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Burr-Brown |
| Reach Compliance Code | unknow |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0244% |
| 模拟输入通道数量 | 4 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 2.7/5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.2 MHz |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| ADS7841EB | ADS7841 | ADS7841E | ADS7841PB | ADS7841P | |
|---|---|---|---|---|---|
| 描述 | 4-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16 | CMOS Hex Inverting Buffer/Converter 16-CDIP -55 to 125 | 4-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16 | 4-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP16 | 12-Bit, 4-Channel Serial Output Sampling ANALOG-TO-DIGITAL CONVERTER |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Burr-Brown | - | Burr-Brown | Burr-Brown | Burr-Brown |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow |
| 最大模拟输入电压 | 5 V | - | 5 V | 5 V | 5 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.0244% | - | 0.0488% | 0.0244% | 0.0488% |
| 模拟输入通道数量 | 4 | - | 4 | 4 | 4 |
| 位数 | 12 | - | 12 | 12 | 12 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY | - | BINARY | BINARY | BINARY |
| 输出格式 | SERIAL | - | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | SSOP | DIP | DIP |
| 封装等效代码 | SSOP16,.25 | - | SSOP16,.25 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE | IN-LINE |
| 电源 | 2.7/5 V | - | 2.7/5 V | 2.7/5 V | 2.7/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.2 MHz | - | 0.2 MHz | 0.2 MHz | 0.2 MHz |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 0.635 mm | - | 0.635 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
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