D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 0.25us Settling Time, CDIP28, 0.600 INCH, CERAMIC, DIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Exar |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP28,.6 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 36.58 mm |
| 最大线性误差 (EL) | 0.1953% |
| 位数 | 8 |
| 功能数量 | 4 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.89 mm |
| 标称安定时间 (tstl) | 0.25 µs |
| 最大压摆率 | 0.05 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| MP7628SD/883 | MP7628CD | MP7628UD | MP7628UD/883 | MP7628LS | |
|---|---|---|---|---|---|
| 描述 | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 0.25us Settling Time, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | D/A Converter, 8-Bit, 4 Func, CMOS, CDIP28 | D/A Converter, 8-Bit, 4 Func, CMOS, CDIP28 | D/A Converter, 8-Bit, 4 Func, CMOS, CDIP28 | D/A Converter, 8-Bit, 4 Func, CMOS, PDSO28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Exar | Exar | Exar | Exar | Exar |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | SOP, SOP28,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| JESD-30 代码 | R-GDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.1953% | 0.05% | 0.05% | 0.05% | 0.05% |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | SOP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | SOP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| Is Samacsys | - | N | N | N | N |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
