Single-Supply Voltage Translator 6-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, |
| 针数 | 6 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | SINGLE-SUPPLY VOLTAGE-LEVEL TRANSLATOR |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XBGA-B6 |
| JESD-609代码 | e1 |
| 长度 | 1.4 mm |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | PUSH-PULL |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大压摆率 | 0.0009 mA |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 2.3 V |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 0.9 mm |
| SN74AUP1T57YFPR | MB08S | SN74AUP1T57DBVT | SN74AUP1T57DCKRE4 | SN74AUP1T57DCKR | SN74AUP1T57DRYR | SN74AUP1T57DCKRG4 | SN74AUP1T57DSFR | SN74AUP1T57YZPR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Single-Supply Voltage Translator 6-DSBGA -40 to 85 | Silicon Bridge Rectifiers | Single-Supply Voltage Translator 6-SOT-23 -40 to 85 | Single-Supply Voltage Translator 6-SC70 -40 to 85 | Single-Supply Voltage Translator 6-SC70 -40 to 85 | Single-Supply Voltage Translator 6-SON -40 to 85 | Single-Supply Voltage Translator 6-SC70 -40 to 85 | Single-Supply Voltage Translator 6-SON -40 to 85 | Single-Supply Voltage Translator 6-DSBGA -40 to 85 |
| Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | - | SOT-23 | SOIC | SOIC | SON | SOIC | SON | BGA |
| 包装说明 | VFBGA, | - | LSSOP, | TSSOP, TSSOP6,.08 | TSSOP, | SON, | TSSOP, TSSOP6,.08 | SON, | VFBGA, |
| 针数 | 6 | - | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | - | - | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | 1 week | - | 1 week | - | 1 week | 1 week | - | 6 weeks | 1 week |
| 接口集成电路类型 | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XBGA-B6 | - | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-N6 | R-PDSO-G6 | R-PDSO-N6 | R-XBGA-B6 |
| JESD-609代码 | e1 | - | e4 | e4 | e4 | e4 | e4 | e4 | e1 |
| 长度 | 1.4 mm | - | 2.9 mm | 2 mm | 2 mm | - | 2 mm | - | 1.4 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | - | 1 | - | 1 | 1 | - | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | - | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | PUSH-PULL | - | PUSH-PULL | - | PUSH-PULL | PUSH-PULL | - | PUSH-PULL | PUSH-PULL |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VFBGA | - | LSSOP | TSSOP | TSSOP | SON | TSSOP | SON | VFBGA |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/3.3 V | - | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 2.5/3.3 V | 1.2/3.3 V | 2.5/3.3 V | 1.2/3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.5 mm | - | 1.45 mm | 1.1 mm | 1.1 mm | - | 1.1 mm | - | 0.5 mm |
| 最大压摆率 | 0.0009 mA | - | 0.0009 mA | - | 0.0009 mA | 0.0009 mA | - | 0.0009 mA | 0.0009 mA |
| 最大供电电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | - | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | BALL |
| 端子节距 | 0.5 mm | - | 0.95 mm | 0.65 mm | 0.65 mm | - | 0.65 mm | - | 0.5 mm |
| 端子位置 | BOTTOM | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 0.9 mm | - | 1.6 mm | 1.25 mm | 1.25 mm | - | 1.25 mm | - | 0.9 mm |
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