Buffers & Line Drivers Octal Buffer Driver
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP20,.25,16 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| 控制类型 | ENABLE LOW |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP20,.25,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 13.5 ns |
| 传播延迟（tpd） | 18 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| SN74LV244ADGVRG4 | SN74LV244ADGVRE4 | SN74LV244ANSRE4 | SN74LV244APWE4 | SN74LV244APWTG4 | SN74LV244ARGYRG4 | SN74LV244APWTE4 | |
|---|---|---|---|---|---|---|---|
| 描述 | Buffers & Line Drivers Octal Buffer Driver | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffer Driver | Buffers & Line Drivers Octal Buffer Driver | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | TSSOP | TSSOP | QFN | TSSOP |
| 包装说明 | TSSOP, TSSOP20,.25,16 | TSSOP, TSSOP20,.25,16 | SOP, SOP20,.3 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | GREEN, PLASTIC, MO-241BC, VQFN-20 | TSSOP, TSSOP20,.25 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | ENABLE LOW | ENABLE LOW |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | - | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | - | R-PQCC-N20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 | e4 |
| 长度 | 5 mm | 5 mm | 12.6 mm | 6.5 mm | - | 4.5 mm | 6.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.008 A | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 2 | 1 |
| 位数 | 4 | 4 | 4 | 4 | - | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | - | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SOP | TSSOP | - | HVQCCN | TSSOP |
| 封装等效代码 | TSSOP20,.25,16 | TSSOP20,.25,16 | SOP20,.3 | TSSOP20,.25 | - | LCC20/24,.14X.18,20 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TR | TR | TAPE AND REEL | TUBE | - | TAPE AND REEL | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 13.5 ns | 13.5 ns | 13.5 ns | 13.5 ns | - | 13.5 ns | 13.5 ns |
| 传播延迟（tpd） | 18 ns | 18 ns | 18 ns | 18 ns | - | 18 ns | 18 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 2 mm | 1.2 mm | - | 1 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - | NO LEAD | GULL WING |
| 端子节距 | 0.4 mm | 0.4 mm | 1.27 mm | 0.65 mm | - | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 4.4 mm | 5.3 mm | 4.4 mm | - | 3.5 mm | 4.4 mm |
FPGA/CPLD
电源技术
模拟电子
嵌入式系统
DIY/开源硬件专区
stm32/stm8
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