ATM Network Interface, 1-Func, CMOS, PQFP64, 10 X 10 MM, STQFP-64
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 64 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 长度 | 10 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | ATM/SONET/SDH NETWORK INTERFACE |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 10 mm |
| IDT77101L25TF9 | IDT77101L25STQFP | IDT77101L25TF | IDT77101L25TF8 | |
|---|---|---|---|---|
| 描述 | ATM Network Interface, 1-Func, CMOS, PQFP64, 10 X 10 MM, STQFP-64 | ATM Network Interface, 1-Func, CMOS, PQFP64, 10 X 10 MM, STQFP-64 | ATM Network Interface, 1-Func, CMOS, PQFP64, 10 X 10 MM, STQFP-64 | ATM Network Interface, 1-Func, CMOS, PQFP64, 10 X 10 MM, STQFP-64 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | LFQFP, | LFQFP, | LFQFP, QFP64,.47SQ,20 | LFQFP, |
| 针数 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | compliant | compliant | not_compliant | compliant |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP | LFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) | 240 | NOT SPECIFIED | 225 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | ATM/SONET/SDH NETWORK INTERFACE | ATM/SONET/SDH NETWORK INTERFACE | ATM/SONET/SDH NETWORK INTERFACE | ATM/SONET/SDH NETWORK INTERFACE |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | Tin/Lead (Sn85Pb15) | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | 30 | 20 |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm |
| 湿度敏感等级 | 3 | - | 3 | 3 |
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