Digital Bus Switch ICs Auto Cat Sngl Inverter
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP20,.25,16 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 系列 | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP20,.25,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3 V |
| 传播延迟（tpd） | 0.25 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 74CBTLV3245ADGVRE4 | 74CBTLV3245ADBQRE4 | 74CBTLV3245ADGVRG4 | 74CBTLV3245ADBQRG4 | 74CBTLV3245ADWRE4 | 74CBTLV3245ARGYRG4 | SN74CBTLV3245AGQNR | SN74CBTLV3245APWE4 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs Auto Cat Sngl Inverter | Digital Bus Switch ICs Auto Cat Sngl 2-Inp Positive-AND Gate | Digital Bus Switch ICs Lo-Vltg Octal FET Bus Sw | Digital Bus Switch ICs Lo-Vltg Octal FET Bus Sw | Digital Bus Switch ICs Low-Voltage Octal FET Bus Switch | Digital Bus Switch ICs 16-Bit Edg-Trig D-Ty F-F W/3-State Otpt | Digital Bus Switch ICs SN74CBTLV3245A GQNR & ZQNR setup | Digital Bus Switch ICs SINGLE BUFFER GATE |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | QSOP | SOIC | QSOP | SOIC | QFN | BGA | TSSOP |
| 包装说明 | TSSOP, TSSOP20,.25,16 | SSOP, SSOP20,.25 | TSSOP, TSSOP20,.25,16 | SSOP, SSOP20,.25 | SOP, SOP20,.4 | HVQCCN, LCC20/24,.14X.18,20 | PLASTIC, VFBGA-20 | GREEN, PLASTIC, TSSOP-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | _compli | unknow |
| 系列 | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | - | CBTLV/3B | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | - | R-PBGA-B20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e0 | e4 |
| 长度 | 5 mm | 8.65 mm | 5 mm | 8.65 mm | 12.8 mm | - | 4 mm | 6.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 2 | 1 | 2 | 1 | - | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | - | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SSOP | TSSOP | SSOP | SOP | - | VFBGA | TSSOP |
| 封装等效代码 | TSSOP20,.25,16 | SSOP20,.25 | TSSOP20,.25,16 | SSOP20,.25 | SOP20,.4 | - | BGA20,4X5,25 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | - | 240 | 260 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | - | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.75 mm | 1.2 mm | 1.75 mm | 2.65 mm | - | 1 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | BALL | GULL WING |
| 端子节距 | 0.4 mm | 0.635 mm | 0.4 mm | 0.635 mm | 1.27 mm | - | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 3.9 mm | 4.4 mm | 3.9 mm | 7.5 mm | - | 3 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
模拟与混合信号
实时操作系统RTOS
stm32/stm8
stm32/stm8
嵌入式系统
微控制器 MCU
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