Digital Bus Switch ICs 10-Bit 2.5-V/3.3-V Lo-V FET Bus Switch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SSOP, SSOP24,.24 |
| 针数 | 24 |
| Reach Compliance Code | compli |
| 其他特性 | ALSO OPERATES WITH 3.3V SUPPLY |
| 系列 | CB3Q/3VH/3C/2B |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e4 |
| 长度 | 8.65 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 2 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP24,.24 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3 V |
| 传播延迟（tpd） | 0.15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| 74CB3Q3384ADBQRE4 | 74CB3Q3384ADGVRE4 | 74CB3Q3384ADGVRG4 | 74CB3Q3384ADBQRG4 | SN74CB3Q3384APWE4 | SN74CB3Q3384APWRE4 | SN74CB3Q3384APWRG4 | |
|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs 10-Bit 2.5-V/3.3-V Lo-V FET Bus Switch | Digital Bus Switch ICs 10-Bit 2.5-V/3.3-V Lo-V FET Bus Switch | Digital Bus Switch ICs 10B 2.5V/3.3V Lo- Vltg FET Bus Sw | Digital Bus Switch ICs 10B 2.5V/3.3V Lo- Vltg FET Bus Sw | Digital Bus Switch ICs 25-Bit Configurable Registered Buffer | Digital Bus Switch ICs 25-Bit Configurable Registered Buffer | Digital Bus Switch ICs 10B 2.5 V 3.3 V LO VLTG FETBus Swtch |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | TSSOP | TSSOP | TSSOP |
| 包装说明 | SSOP, SSOP24,.24 | TSSOP, TSSOP24,.25,16 | TSSOP, TSSOP24,.25,16 | SSOP, SSOP24,.24 | TSSOP, TSSOP24,.25 | TSSOP, TSSOP24,.25 | TSSOP, TSSOP24,.25 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compli | compli | compli | compli | unknow | unknow | unknow |
| 其他特性 | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY |
| 系列 | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 8.65 mm | 5 mm | 5 mm | 8.65 mm | 7.8 mm | 7.8 mm | 7.8 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 2 | 1 | 1 | 2 | 1 | 1 | 1 |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | TSSOP | TSSOP | SSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | SSOP24,.24 | TSSOP24,.25,16 | TSSOP24,.25,16 | SSOP24,.24 | TSSOP24,.25 | TSSOP24,.25 | TSSOP24,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.2 mm | 1.2 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.4 mm | 0.4 mm | 0.635 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 4.4 mm | 4.4 mm | 3.9 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
FPGA/CPLD
嵌入式系统
51单片机
淘e淘
DSP 与 ARM 处理器
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
