1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, ROHS COMPLIANT, SOIC-16
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 16 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 5 V |
最小模拟输入电压 | |
最长转换时间 | 5.6 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e3 |
长度 | 10.3 mm |
最大线性误差 (EL) | 0.0122% |
湿度敏感等级 | 1 |
标称负供电电压 | -15 V |
模拟输入通道数量 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
座面最大高度 | 2.65 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.5 mm |
MAX170CEWE+ | MAX170CEPA+ | MAX170CEPA | MAX170DCWE | MAX170CCWE | MAX170DCPA | |
---|---|---|---|---|---|---|
描述 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, ROHS COMPLIANT, SOIC-16 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, PLASTIC, DIP-8 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, SOP-16 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, SOP-16 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, PLASTIC, DIP-8 |
是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOIC | DIP | DIP | SOIC | SOIC | DIP |
包装说明 | SOP, | ROHS COMPLIANT, PLASTIC, DIP-8 | DIP, | SOP, | SOP, | DIP, |
针数 | 16 | 8 | 8 | 16 | 16 | 8 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown |
最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
最长转换时间 | 5.6 µs | 5.6 µs | 5.6 µs | 5.6 µs | 5.6 µs | 5.6 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G16 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T8 |
JESD-609代码 | e3 | e3 | e0 | e0 | e0 | e0 |
长度 | 10.3 mm | 9.375 mm | 9.375 mm | 10.3 mm | 10.3 mm | 9.375 mm |
最大线性误差 (EL) | 0.0122% | 0.0122% | 0.0122% | 0.0122% | 0.0122% | 0.0122% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 8 | 8 | 16 | 16 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | SOP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
峰值回流温度(摄氏度) | 260 | 260 | 240 | 240 | 240 | 240 |
座面最大高度 | 2.65 mm | 4.572 mm | 4.572 mm | 2.65 mm | 2.65 mm | 4.572 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN | TIN | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 20 | 20 | 20 | 20 |
宽度 | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | - | Rochester Electronics | Rochester Electronics |
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