电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

BU-65170S2-110W

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQIP70, 48.30 X 25.40 MM, 4.19 MM HEIGHT, DIP-70
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小563KB,共44页
制造商Data Device Corporation
下载文档 详细参数 全文预览

BU-65170S2-110W概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQIP70, 48.30 X 25.40 MM, 4.19 MM HEIGHT, DIP-70

BU-65170S2-110W规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Data Device Corporation
零件包装代码QIP
包装说明QIP,
针数70
Reach Compliance Codecompliant
地址总线宽度16
边界扫描NO
最大时钟频率16 MHz
通信协议MIL STD 1553A; MIL STD 1553B
数据编码/解码方法BIPH-LEVEL(MANCHESTER)
最大数据传输速率0.125 MBps
外部数据总线宽度16
JESD-30 代码R-CQIP-P70
JESD-609代码e0
长度48.26 mm
低功率模式NO
串行 I/O 数2
端子数量70
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QIP
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
筛选级别MIL-PRF-38534
座面最大高度4.19 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式PIN/PEG
端子节距2.54 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度25.4 mm
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

文档预览

下载PDF文档
BU-65170/61580 and BU-61585
MIL-STD-1553A/B NOTICE 2 RT and BC/RT/MT,
ADVANCED COMMUNICATION ENGINE (ACE)
ACE User’s Guide
Also Available
DESCRIPTION
DDC's BU-65170, BU-61580 and
BU-61585 Bus Controller / Remote
Terminal
/
Monitor
Terminal
(BC/RT/MT)
A d v a n c e d
Communication Engine (ACE) termi-
nals comprise a complete integrated
interface between a host processor
and a MIL-STD-1553 A and B or
STANAG 3838 bus.
The ACE series is packaged in a 1.9 -
square-inch, 70-pin, low-profile,
cofired MultiChip Module (MCM)
ceramic package that is well suited for
applications with stringent height
requirements.
The BU-61585 ACE integrates dual
transceiver, protocol, memory man-
agement, processor interface logic,
and a total of 12K words of RAM in a
choice of DIP or flat pack packages.
The BU-61585 requires +5 V power
and either -15 V or -12 V power.
The BU-61585 internal RAM can be
configured as 12K x 16 or 8K x 17.
The 8K x 17 RAM feature provides
capability for memory integrity check-
ing by implementing RAM parity gen-
eration and verification on all access-
es. To minimize board space and
“glue” logic, the ACE provides ultimate
flexibility in interfacing to a host
processor and internal/external RAM.
The advanced functional architecture
of the ACE terminals provides soft-
ware
compatibility
to
DDC's
Advanced Integrated Multiplexer (AIM)
series hybrids, while incorporating a
multiplicity of architectural enhance-
ments. It allows flexible operation
while off-loading the host processor,
ensuring data sample consistency,
and supports bulk data transfers.
The ACE hybrids may be operated at
either 12 or 16 MHz. Wire bond
options allow for programmable RT
address (hardwired is standard) and
external transmitter inhibit inputs.
FEATURES
Fully Integrated MIL-STD-1553
Interface Terminal
Interface
Flexible Processor/Memory
Standard 4K x 16 RAM and
Optional RAM Parity
Optional 12K x 16 or 8K x 17 RAM
Available
Generation/Checking
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Flexible RT Data Buffering
Programmable Illegalization
Selective Message Monitor
Simultaneous RT/Monitor Mode
TX/RX_A
SHARED
RAM
CH. A
TRANSCEIVER
A
DATA
BUFFERS
PROCESSOR
DATA BUS
*
TX/RX_A
DATA BUS
DUAL
ENCODER/DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
D15-D0
TX/RX_B
ADDRESS BUS
ADDRESS
BUFFERS
A15-A0
PROCESSOR
ADDRESS BUS
CH. B
TRANSCEIVER
B
TX/RX_B
PROCESSOR
AND
MEMORY
INTERFACE
LOGIC
TRANSPARENT/BUFFERED, STRBD, SELECT,
RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,
MSB/LSB/DTGRT
IOEN, MEMENA-OUT, READYD
ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,
8/16-BIT/DTREQ, POLARITY_SEL/DTACK
INT
PROCESSOR
AND
MEMORY
CONTROL
INTERRUPT
REQUEST
RT ADDRESS
RTAD4-RTAD0, RTADP
INCMD
MISCELLANEOUS
CLK_IN, TAG_CLK,
MSTCLR,SSFLAG/EXT_TRG
* SEE ORDERING INFORMATION FOR AVAILABLE MEMORY
FIGURE 1. ACE BLOCK DIAGRAM
©
1992, 1999 Data Device Corporation
微波电路及设计的基础知识
微波电路及设计的基础知识...
mzxiang8 无线连接
modelsim后仿真总是提示加载失败
我用modelsim6.5b做后仿真怎么都提示加载失败,怎么解决啊?文件编译都成功的啊,帮帮我高手们,我需要详细的解答。谢谢...
xrk709 FPGA/CPLD
CC2640之TIRTOS添加IIC配置
测试环境 协议栈版本:BLE-STACK V2.1 IAR开发环境版本:IAR for Arm 7.40 硬件设备:Amo-SmartRF v2.0 开发板(对应TI官方的SmartRF06EB 开发板) 添加IIC定义 TI 释放的SDK中没 ......
灞波儿奔 无线连接
ALtiumDesinger winter09 画不规则封装
如何用Altium 画附件这样的器件封装啊 ? 我用Place-->Solid Region虽然能画出这个6脚的形状 但是不能在上面放上引脚标号,这样会导致到时候布线的问题,求高手指教啊。。...
jiangwei0802 PCB设计
招聘嵌入式软件工程师或硬件主管。版主手下留情!
如有想换工作可以到这个网站看看http//www.choicemmed.com mail:hr@choicemmed.com...
yattai 嵌入式系统
防静电方法:静电敏感元件搬运讲解
静电敏感元件储存搬运有什么方法? 静电敏感元件在储存和运输过程中会暴露于有静电的区域中,用静电屏蔽的方法可削弱外界静电对电子元件的影响。最通常的方法是用静电屏蔽袋和防静电周转箱 ......
ESD技术咨询 工业自动化与控制

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1045  2489  1822  427  2471  54  32  36  37  59 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved