256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 内存密度 | 2048 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.91 mm |
| 最长写入周期时间 (tWC) | 1 ms |
| Base Number Matches | 1 |
| 24C02CT/SNVAO | 24C02C/SNVA0 | 24C02CT/MCG | 24C02C/MSG | 24C02C/MCG | 24C02CT/MS | 24C02CT/MSG | 24C02C/MS | 24C02CT/MC | 24C02C/MC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SON | TSSOP | SON | TSSOP | TSSOP | TSSOP | SON | SON |
| 包装说明 | 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | LEAD FREE, PLASTIC, MO-187, MSOP-8 | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | LEAD FREE, PLASTIC, MO-187, MSOP-8 | LEAD FREE, PLASTIC, MO-187, MSOP-8 | LEAD FREE, PLASTIC, MO-187, MSOP-8 | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | S-PDSO-G8 | R-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.9 mm | 4.9 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 内存密度 | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | HVSSON | TSSOP | HVSSON | TSSOP | TSSOP | TSSOP | HVSSON | HVSSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1 mm | 1.1 mm | 1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1 mm | 1 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 3.91 mm | 3.91 mm | 2 mm | 3 mm | 2 mm | 3 mm | 3 mm | 3 mm | 2 mm | 2 mm |
| 最长写入周期时间 (tWC) | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 数据保留时间-最小值 | - | - | 200 | 200 | 200 | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | - | - | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| 封装等效代码 | - | - | SOLCC8,.11,20 | TSSOP8,.19 | SOLCC8,.11,20 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.11,20 | SOLCC8,.11,20 |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | - | - | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 写保护 | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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