DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SHINDENGEN |
零件包装代码 | MODULE |
包装说明 | DIP, DIP18,4.1,200 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
最大输入电压 | 60 V |
最小输入电压 | 40 V |
标称输入电压 | 48 V |
JESD-30 代码 | R-XXMA-X |
JESD-609代码 | e0 |
最大负载调整率 | 5% |
湿度敏感等级 | 2 |
功能数量 | 1 |
输出次数 | 1 |
端子数量 | 13 |
最高工作温度 | 80 °C |
最低工作温度 | -10 °C |
最大输出电流 | 2.5 A |
最大输出电压 | 24.72 V |
最小输出电压 | 23.28 V |
标称输出电压 | 24 V |
封装主体材料 | UNSPECIFIED |
封装代码 | DIP |
封装等效代码 | DIP18,4.1,200 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | HYBRID |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | UNSPECIFIED |
端子节距 | 5.08 mm |
端子位置 | UNSPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
最大总功率输出 | 60 W |
微调/可调输出 | NO |
HGG242R5 | HGE02015 | HGG05012 | HGE242R5 | HGE12005 | HGG02015 | HGG096R6 | HGG15004 | |
---|---|---|---|---|---|---|---|---|
描述 | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE | DC-DC Regulated Power Supply Module, 1 Output, 60W, Hybrid, 4.530 X 2.280 INCH, 0.500 INCH HEIGHT, LOW PROFILE PACKAGE |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN |
包装说明 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 | DIP, DIP18,4.1,200 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
最大输入电压 | 60 V | 32 V | 60 V | 32 V | 32 V | 60 V | 60 V | 60 V |
最小输入电压 | 40 V | 20 V | 40 V | 20 V | 20 V | 40 V | 40 V | 40 V |
标称输入电压 | 48 V | 24 V | 48 V | 24 V | 24 V | 48 V | 48 V | 48 V |
JESD-30 代码 | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XDMA-P13 | R-XXMA-X | R-XXMA-X | R-XXMA-X |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
湿度敏感等级 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 13 | 13 | 13 | 13 | 13 | 13 | 13 | 13 |
最高工作温度 | 80 °C | 80 °C | 80 °C | 80 °C | 80 °C | 80 °C | 80 °C | 80 °C |
最低工作温度 | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C |
最大输出电流 | 2.5 A | 15 A | 12 A | 2.5 A | 5 A | 15 A | 6.6 A | 4 A |
最大输出电压 | 24.72 V | 2.06 V | 5.15 V | 24.72 V | 12.36 V | 2.06 V | 9.27 V | 15.45 V |
最小输出电压 | 23.28 V | 1.94 V | 4.85 V | 23.28 V | 11.64 V | 1.94 V | 8.73 V | 14.55 V |
标称输出电压 | 24 V | 2 V | 5 V | 24 V | 12 V | 2 V | 9 V | 15 V |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP18,4.1,200 | DIP18,4.1,200 | DIP18,4.1,200 | DIP18,4.1,200 | DIP18,4.1,200 | DIP18,4.1,200 | DIP18,4.1,200 | DIP18,4.1,200 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PIN/PEG | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
端子节距 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | DUAL | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
最大总功率输出 | 60 W | 60 W | 60 W | 60 W | 60 W | 60 W | 60 W | 60 W |
微调/可调输出 | NO | NO | NO | NO | NO | NO | NO | NO |
零件包装代码 | MODULE | MODULE | MODULE | MODULE | - | MODULE | MODULE | MODULE |
最大负载调整率 | 5% | - | 5% | 5% | 5% | - | - | 5% |
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