OP-AMP, 730uV OFFSET-MAX, 1MHz BAND WIDTH, PDSO8, SOP-8
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.01 µA |
| 标称共模抑制比 | 110 dB |
| 最大输入失调电压 | 730 µV |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.902 mm |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 座面最大高度 | 1.753 mm |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.899 mm |
| LM308AM | LM108AH/NOPB | LM308AH/NOPB | LM308AJ-8 | LM308AN | LM108AH | LM108AJ-8 | LM208AH | LM208AJ-8 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | OP-AMP, 730uV OFFSET-MAX, 1MHz BAND WIDTH, PDSO8, SOP-8 | IC OPAMP GP TO99-8 | IC OPAMP GP TO99-8 | OP-AMP, 730uV OFFSET-MAX, 1MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 | OP-AMP, 730uV OFFSET-MAX, 1MHz BAND WIDTH, DIP8, DIP-8 | OP-AMP, 1000uV OFFSET-MAX, 1MHz BAND WIDTH, MBCY8, METAL CAN-8 | OP-AMP, 1000uV OFFSET-MAX, 1MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 | OP-AMP, 1000uV OFFSET-MAX, 1MHz BAND WIDTH, MBCY8, METAL CAN-8 | OP-AMP, 1000uV OFFSET-MAX, 1MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | BCY | TO-5 | DIP | DIP | BCY | DIP | BCY | DIP |
| 包装说明 | SOP, | , CAN8,.2 | , CAN8,.2 | CERAMIC, DIP-8 | DIP, | , | DIP, | , | DIP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.01 µA | 0.003 µA | 0.01 µA | 0.01 µA | 0.01 µA | 0.003 µA | 0.003 µA | 0.003 µA | 0.01 µA |
| 标称共模抑制比 | 110 dB | 110 dB | 110 dB | 110 dB | 110 dB | 110 dB | 110 dB | 110 dB | 110 dB |
| 最大输入失调电压 | 730 µV | 1000 µV | 730 µV | 730 µV | 730 µV | 1000 µV | 1000 µV | 1000 µV | 730 µV |
| JESD-30 代码 | R-PDSO-G8 | O-MBCY-W8 | O-MBCY-W8 | R-GDIP-T8 | R-PDIP-T8 | O-MBCY-W8 | R-GDIP-T8 | O-MBCY-W8 | R-GDIP-T8 |
| 负供电电压上限 | -18 V | -20 V | -18 V | -18 V | -18 V | -20 V | -20 V | -20 V | -18 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | METAL | METAL | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | METAL | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | ROUND | ROUND | RECTANGULAR | RECTANGULAR | ROUND | RECTANGULAR | ROUND | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | CYLINDRICAL | CYLINDRICAL | IN-LINE | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL | IN-LINE |
| 供电电压上限 | 18 V | 20 V | 18 V | 18 V | 18 V | 20 V | 20 V | 20 V | 18 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | OTHER | COMMERCIAL |
| 端子形式 | GULL WING | WIRE | WIRE | THROUGH-HOLE | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE | THROUGH-HOLE |
| 端子位置 | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | BOTTOM | DUAL | BOTTOM | DUAL |
| 长度 | 4.902 mm | - | - | 10.16 mm | 9.817 mm | - | 10.16 mm | - | 10.16 mm |
| 封装代码 | SOP | - | - | DIP | DIP | - | DIP | - | DIP |
| 座面最大高度 | 1.753 mm | - | - | 5.08 mm | 5.08 mm | - | 5.08 mm | - | 5.08 mm |
| 端子节距 | 1.27 mm | - | - | 2.54 mm | 2.54 mm | - | 2.54 mm | - | 2.54 mm |
| 宽度 | 3.899 mm | - | - | 7.62 mm | 7.62 mm | - | 7.62 mm | - | 7.62 mm |
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