OTP ROM, 4KX4, 35ns, CMOS, CDIP20,
| 参数名称 | 属性值 |
| 厂商名称 | Monolithic Memories |
| Reach Compliance Code | unknown |
| 最长访问时间 | 35 ns |
| JESD-30 代码 | R-GDIP-T20 |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 4KX4 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 63S1641AJXXXX | 63S1641NLXXXX | 63S1641NXXXX | 63S1641ANLXXXX | 63S1641ANXXXX | 63S1641JXXXX | |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 4KX4, 35ns, CMOS, CDIP20, | OTP ROM, 4KX4, 50ns, CMOS, PQCC28, | OTP ROM, 4KX4, 50ns, CMOS, PDIP20, | OTP ROM, 4KX4, 35ns, CMOS, PQCC28, | OTP ROM, 4KX4, 35ns, CMOS, PDIP20, | OTP ROM, 4KX4, 50ns, CMOS, CDIP20, |
| 厂商名称 | Monolithic Memories | Monolithic Memories | Monolithic Memories | Monolithic Memories | Monolithic Memories | Monolithic Memories |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 35 ns | 50 ns | 50 ns | 35 ns | 35 ns | 50 ns |
| JESD-30 代码 | R-GDIP-T20 | S-PQCC-J28 | R-PDIP-T20 | S-PQCC-J28 | R-PDIP-T20 | R-GDIP-T20 |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 28 | 20 | 28 | 20 | 20 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| 组织 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
| Is Samacsys | - | N | N | N | N | N |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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