Standard SRAM, 16KX4, 12ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 12 ns |
| JESD-30 代码 | R-PDSO-J24 |
| JESD-609代码 | e0 |
| 长度 | 15.88 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX4 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.76 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.62 mm |
| IDT61B98S12Y8 | IDT61B98S10Y8 | IDT61B98S8Y8 | IDT61B98S10Y | IDT61B98S12TP | IDT61B98S8Y | IDT61B98S12Y | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 16KX4, 12ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 10ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 8ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 10ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 12ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 8ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 12ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOJ | SOJ | SOJ | SOJ | DIP | SOJ | SOJ |
| 包装说明 | SOJ, | SOJ, | SOJ, | 0.300 INCH, SOJ-24 | 0.300 INCH, PLASTIC, DIP-24 | 0.300 INCH, SOJ-24 | 0.300 INCH, SOJ-24 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 12 ns | 10 ns | 8 ns | 10 ns | 12 ns | 8 ns | 12 ns |
| JESD-30 代码 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 15.88 mm | 15.88 mm | 15.88 mm | 15.88 mm | 31.6865 mm | 15.88 mm | 15.88 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | SOJ | SOJ | SOJ | DIP | SOJ | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm | 4.191 mm | 3.76 mm | 3.76 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - | - |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | - | NOT SPECIFIED | - | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | NOT SPECIFIED | - | - |
| I/O 类型 | - | - | - | COMMON | COMMON | COMMON | COMMON |
| 封装等效代码 | - | - | - | SOJ24,.34 | DIP24,.3 | SOJ24,.34 | SOJ24,.34 |
| 电源 | - | - | - | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | - | - | - | 0.18 A | 0.16 A | 0.2 A | 0.16 A |
| 最大压摆率 | - | - | - | 0.18 mA | 0.16 mA | 0.2 mA | 0.16 mA |
嵌入式系统
DSP 与 ARM 处理器
电源技术
电子竞赛
stm32/stm8
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
