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IS62WV10248BLL-55TI: 产品描述Standard SRAM, 1MX8, 55ns, CMOS, PDSO44, TSOP2-44; 产品类别存储存储; 文件大小55KB，共12页; 制造商Integrated Silicon Solution ( ISSI )

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IS62WV10248BLL-55TI概述

Standard SRAM, 1MX8, 55ns, CMOS, PDSO44, TSOP2-44

IS62WV10248BLL-55TI规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Integrated Silicon Solution ( ISSI )
零件包装代码	TSOP2
包装说明	TSOP2-44
针数	44
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	55 ns
JESD-30 代码	R-PDSO-G44
JESD-609代码	e0
长度	18.41 mm
内存密度	8388608 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
功能数量	1
端子数量	44
字数	1048576 words
字数代码	1000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	1MX8
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP2
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.8 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	10.16 mm

IS62WV10248BLL-55TI相似产品对比

	IS62WV10248BLL-55TI	IS62WV10248ALL-70BI	IS62WV10248ALL-70T	IS62WV10248ALL-70B	IS62WV10248ALL-70TI	IS62WV10248BLL-55T	IS62WV10248BLL-70B	IS62WV10248BLL-70T	IS62WV10248BLL-70TI	IS62WV10248ALL-70XI
描述	Standard SRAM, 1MX8, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 1MX8, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 1MX8, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 1MX8, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 1MX8, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 1MX8, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 1MX8, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 1MX8, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 1MX8, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 1MX8, 70ns, CMOS, DIE
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
零件包装代码	TSOP2	BGA	TSOP2	BGA	TSOP2	TSOP2	BGA	TSOP2	TSOP2	DIE
包装说明	TSOP2-44	7.20 X 8.70 MM, MINI, BGA-48	TSOP2-44	7.20 X 8.70 MM, MINI, BGA-48	TSOP2-44	TSOP2-44	7.20 X 8.70 MM, MINI, BGA-48	TSOP2-44	TSOP2-44	DIE,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	55 ns	70 ns	70 ns	70 ns	70 ns	55 ns	70 ns	70 ns	70 ns	70 ns
JESD-30 代码	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	X-XUUC-N
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
组织	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
封装代码	TSOP2	LFBGA	TSOP2	LFBGA	TSOP2	TSOP2	LFBGA	TSOP2	TSOP2	DIE
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED
封装形式	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	UNCASED CHIP
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	3.6 V	2.2 V	2.2 V	2.2 V	2.2 V	3.6 V	3.6 V	3.6 V	3.6 V	2.2 V
最小供电电压 (Vsup)	2.5 V	1.65 V	1.65 V	1.65 V	1.65 V	2.5 V	2.5 V	2.5 V	2.5 V	1.65 V
标称供电电压 (Vsup)	3 V	1.8 V	1.8 V	1.8 V	1.8 V	3 V	3 V	3 V	3 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN LEAD
端子形式	GULL WING	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	GULL WING	GULL WING	NO LEAD
端子位置	DUAL	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM	DUAL	DUAL	UPPER
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30
针数	44	48	44	48	44	44	48	44	44	-
长度	18.41 mm	8.7 mm	18.41 mm	8.7 mm	18.41 mm	18.41 mm	8.7 mm	18.41 mm	18.41 mm	-
端子数量	44	48	44	48	44	44	48	44	44	-
座面最大高度	1.2 mm	1.3 mm	1.2 mm	1.3 mm	1.2 mm	1.2 mm	1.3 mm	1.2 mm	1.2 mm	-
端子节距	0.8 mm	0.75 mm	0.8 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm	0.8 mm	0.8 mm	-
宽度	10.16 mm	7.2 mm	10.16 mm	7.2 mm	10.16 mm	10.16 mm	7.2 mm	10.16 mm	10.16 mm	-

IS62WV10248BLL-55TI

IS62WV10248BLL-55TI概述

IS62WV10248BLL-55TI规格参数

IS62WV10248BLL-55TI相似产品对比

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