电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDM02

产品描述D Microminiature Connector, Female, Solder Terminal, Plug; Receptacle
产品类别连接器    连接器   
文件大小282KB,共3页
制造商HiRel Connectors Inc
官网地址https://hirelco.net
下载文档 详细参数 全文预览

HDM02概述

D Microminiature Connector, Female, Solder Terminal, Plug; Receptacle

HDM02规格参数

参数名称属性值
厂商名称HiRel Connectors Inc
Reach Compliance Codeunknown
其他特性MAX CONTACTS (SERIES)=100
主体/外壳类型PLUG; RECEPTACLE
连接器类型D MICROMINIATURE CONNECTOR
联系完成配合GOLD (50) OVER NICKEL
联系完成终止GOLD (50) OVER NICKEL
触点性别FEMALE
DIN 符合性NO
空壳NO
滤波功能NO
IEC 符合性NO
绝缘体材料POLYPHENYLENE SULFIDE
JESD-609代码e4
MIL 符合性NO
制造商序列号HDM
混合触点NO
安装类型CABLE; PANEL
选件GENERAL PURPOSE
外壳面层ANODIZED/CADMIUM/GOLD/NICKEL/TIN
外壳材料ALUMINUM ALLOY; STAINLESS STEEL
外壳尺寸A; B; C; D; E; F; G; H
端接类型SOLDER

文档预览

下载PDF文档
MICROMINIATURE – COTS MICRO-D CONNECTORS
HDM01 THRU 04
PRE-WIRED AND SOLDER CUP TERRMINATIONS
HIRELCO PART NUMBER CODE
HDM 0* - * * * * * *
HIRELCO CONNECTOR SERIES
HDM - MICRO D-SUBMINIATURE
(DESIGNS BASED ON M83513)
CONNECTOR TYPE, GENDER, & TERMINATION
01 - METAL SHELL PLUG, SOLDER CUP <1>
02 - METAL SHELL RECEPTACLE, SOLDER CUP <1>
03 - METAL SHELL PLUG, PRE-WIRED
04 - METAL SHELL RECEPTACLE, PRE-WIRED
CONNECTOR SIZE
(NUMBER OF CONTACTS) <2>
A=9, B=15, C=21, D=25, E=31, F=37, G=51, & H=100
WIRE TYPE & SIZE (AWG)
OMIT FOR SOLDER CUP CONTACTS
STRANDED & INSULATED:
A - MIL-W-22759/11-24 (24 AWG, 19-STRD)
B - MIL-W-22759/32-24 (24 AWG, 19-STRD)
C - MIL-W-22759/33-24 (24 AWG, 19-STRD)
D - MIL-W-16878/4-*** (26 AWG, 7-STRD)
E - MIL-W-16878/4-*** (26 AWG, 19-STRD)
F - MIL-W-22759/11-26 (26 AWG, 19-STRD)
G - MIL-W-22759/32-26 (26 AWG, 19-STRD)
H - MIL-W-22759/33-26 (26 AWG, 19-STRD)
J - 0407-26A-* (26 AWG LOW-OUTGASSING/SPACE)
K - MIL-W-16878/4-BCB* (28 AWG, 19-STRD)
L - MIL-W-22759/32-28 (28 AWG, 19-STRD)
M - MIL-W-22759/33-28 (28 AWG, 7-STRD)
SOLID & UNINSULATED:
5
6
7
8
-
-
-
-
TIN PLATED 25 AWG, SOLID, UNINSULATED PER QQ-W-343
TIN PLATED 24 AWG, SOLID, UNINSULATED PER QQ-W-343
GOLD PLATED 25 AWG, SOLID, UNINSULATED PER QQ-W-343
GOLD PLATED 24 AWG, SOLID, UNINSULATED PER QQ-W-343
FLANGE HARDWARE
SIZES 9-51 USES #2-56, 100 USES #4-40
COMMERCIAL PERMANENT OPTIONS:
A - .125 DIA. MTG. HOLES, FOR SIZE 9-51
.166 DIA MTG HOLES FOR SIZE 100
B - (STANDARD HOLE SIZES PER M83513)
.092 DIA. MTG. HOLES FOR SIZE 9-51
.150/.145 DIA. MTG. HOLE FOR SIZE 100
J - CAPTIVE, HIGH PROFILE .050 HEX JACKSCREW
K - CAPTIVE, HIGH PROFILE SLOTTED JACKSCREW
L - CAPTIVE, LOW PROFILE .050 HEX JACKSCREW
F - STANDARD FLOAT MOUNT
R - REVERSE FLOAT MOUNT
T - THREADED INSERT
MILITARY OPTIONS (FROM M83513/05-XX)
2 - LOW PROFILE .050 HEX JACKSCREW
3 - HIGH PROFILE .050 HEX JACKSCREW
5 - LOW PROFILE SLOTTED JACKSCREW
6 - HIGH PROFILE SLOTTED JACKSCREW
7 - JACKPOST KIT
SHELL FINISH (& MATERIAL)
A - ANODIZE (ALUMINUM)
C - CADMIUM (ALUMINUM)
G - GOLD (ALUMINUM)
N - ELECTROLESS NICKEL (ALUMINUM)
S - PASSIVATION (STAINLESS STEEL)
T - TIN (ALUMINUM)
WIRE LENGTH
OMIT FOR SOLDER CUP CONTACTS
1
2
3
4
5
6
7
8
9
-
-
-
-
-
-
-
-
-
0.25
0.50 (SOLID WIRE ONLY, + 0.20/- 0.00)
1.00
6.00
12.00
18.00
(STRANDED WIRE ONLY, + 1.00/- 0.00)
24.00
36.00
72.00
WIRE COLOR/FINISH
OMIT FOR SOLDER CUP CONTACTS
1 - ALL WHITE
2 - ALL YELLOW
3 - FIRST 10 COLORS BLK THRU WHT REPEATS
4 - FULL COLOR CODED PER MIL-STD-681, SYSTEM 1
0 - SOLID WIRE TERMINATION
<1> - CONNECTOR TERMINATION TYPE NOT AVAILABLE AT TIME OF PRINTING.
CONTACT FACTORY FOR CURRENT AVAILABILITY.
<2> - ADDITIONAL SIZES MAY BE AVAILABLE. CONTACT FACTORY FOR CURRENT AVAILABILITY.
J - HIGH PROFILE HEX
K - HIGH PROFILE SLOTTED
L - LOW PROFILE HEX
CAPTIVE PERMANENT JACKSCREW OPTIONS
(FOR MILITARY HARDWARE OPTIONS, SEE HMM05 PAGE IN HMM OR HARDWARE AND ACCESSORIES SECTIONS)
SEE THE FIRST PAGE OF THIS SECTION FOR PERFORMANCE, MATERIAL, AND PLATING INFORMATION
United States
– 760 W. Wharton Drive, Claremont CA. 91711
Ph: 909-626-1820
FAX: 909-399-0626
Web:
www.HIRELCO.com
Europe
5 Rue Des Longues Raies, Z.I. Des Garennes, 78440; Gargenville, France
Ph: 33(0) 1-309-38999 or U.K. 44(0)1-980-843887
FAX 33(0) 1-309-38913
Web:
www.HIRELCO.com
18
EK-LM3S8962开发板在ti哪里联系购买啊?
EK-LM3S8962开发板在ti哪里联系购买啊?...
ssawee 微控制器 MCU
TI MSP430的晶振布局要领
在网上找的TI的MSP430的PCB布局要领,希望对大家有帮助啊!...
xiaocai2012 TI技术论坛
tosbase 和xmeshbase有什么不同??
tosbase 和xmeshbase有什么不同?...
lhybupt 嵌入式系统
嵌入式系统交叉调试原理和方法
嵌入式系统交叉调试方法一般分为两种,一种是基于JTAG的片上调试方法,一种是基于调试代理的远程调试方法。JTAG是一种国际标准芯片测试协议,目前大多数CPU体系都支持JTAG。基于JTAG的片上调试 ......
jingcheng ARM技术
5 任务间通信与同步
本帖最后由 兰博 于 2018-8-15 13:28 编辑 对一个多任务的操作系统来说,任务间的通信和同步是必不可少的。uC/OS-II中提供了4种同步对象,分别是信号量,邮箱,消息队列和事件。所有这些同步 ......
兰博 嵌入式系统
multism仿真单片机时出了的问题
本帖最后由 paulhyde 于 2014-9-15 09:13 编辑 我在另一个版块没法解决,只好转移到这来问了, 下面的sbit a=P1^0在multisim里不能用吗? 我用multisim仿真8052时却出了一个问题,仿真不了 ......
ckx提问 电子竞赛

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 652  2696  1676  1728  1081  14  55  34  35  22 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved