电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDWM-25-56-L-D-300-SM

产品描述Board Stacking Connector
产品类别连接器    连接器   
文件大小578KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

HDWM-25-56-L-D-300-SM概述

Board Stacking Connector

HDWM-25-56-L-D-300-SM规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD (10) OVER NICKEL (50)
联系完成终止Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别MALE
触点材料PHOSPHOR BRONZE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距1.27 mm
端接类型SURFACE MOUNT
触点总数50

文档预览

下载PDF文档
F-215
HDWM–24–59–L–S–300–SM
DWM–20–58–G–S–427
DWM–06–54–G–D–360
HDWM–08–56–L–D–312-SM
(1,27 mm) .050"
DWM, HDWM SERIES
MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications
see www.samtec.com?DWM
or www.samtec.com?HDWM
Insulator Material:
LCP
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +105°C with Tin
-55°C to +125°C with Gold
RoHS Compliant:
Yes
Mates with:
SMS, SLM, RSM
B o a rd
Stacking
SO CK ET
PR OF ILE
OV ER AL L PO ST
T/ H
PI N
(O AL )
OV ER AL L
SM T
PI N
(O AL )
BO AR D
SP AC E
ST AC KE R
HE IG HT
Variable
stacker
height
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,15 mm) .006" max
TA IL
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
Choice of
Surface
mount or
Through-hole
Ideal for high density
“skyscraper”
board stacking
TYPE
STRIP
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
OTHER
OPTION
FILE NO: 090871_0_000
(DWM ONLY)
01
thru
50
DWM
–L
= 10µ"
(0,25 µm)
Gold contact,
Matte Tin
on tail
–S
= Single
Row
–“XXX”
= Stacker
Height
Example:
–250 =
(6,35 mm)
.250"
– “XXX”
= Polarized
Position
(Specify position
of omitted pin)
–D
= Double
Row
LEAD
STYLE THROUGH-
HOLE
(11,43) .450
–01
(10,41) .410
–51
(10,80) .425
–52
(12,83) .505
–53
(14,10) .555
–54
(15,49) .610
–55
(15,88) .625
–56
(16,51) .650
–57
(17,91) .705
–58
(19,18) .755
–59
(20,96) .825
–60
–61
(26,67) 1.050
= Standard Board Spacer
–G
= 10µ"
(0,25 µm)
Gold on post,
Gold flash
on tail
OAL
SURFACE
MOUNT
(8,38) .330
(9,78) .385
(11,05) .435
(12,45) .490
(12,83) .505
(13,46) .530
(14,86) .585
(15,62) .615
HDWM
= High Temp Board Spacer
(1,27) .050 X
No. of Positions
01
= Surface Mount
(Requires HDWM.
02 thru 40
positions only.)
– SM
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
(2,54)
.100
50
(2,48)
.098
(1,27) .050 TYP
02
100
= Alignment Pin
(Requires HDWM.
6 positions min
–D only.)
Metal or plastic at
Samtec discretion
(N/A with –LC)
–A
(4,98)
.196
01
99
(0,46) .018 SQ
(0,00)
.000
MIN
(0,51)
.020
Note:
For added mechanical
stability, Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
Note:
This Series is
non-standard, non-returnable.
(2,54)
.100
(3,05)
.120
STACKER
HEIGHT
OAL
(5,08)
.200
MIN
(1,27)
.050
TYP
STACKER
HEIGHT
OAL
(6,35)
(1,27) .250
MIN
.050
= Locking Clip
(Requires HDWM.
(5 positions min.
–D only)
(N/A with –A)
(Manual placement
required)
– LC
= Pick & Place Pad
(Requires HDWM)
–P
(0,51) .020 DIA
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
焊接基础知识问答--焊接材料
1. 什么叫焊接材料?包括哪些内容? 答:焊接材料包括焊条、焊丝、焊剂、气体、电极、衬垫等。 2.什么叫焊丝? 答:焊接时作为填充金属,同时用来导电的金属丝—叫焊丝。分实心焊丝 ......
wanggq 测试/测量
物联网智能家居手机wifi控制usb风扇实验
物联网智能家居手机wifi控制usb风扇实验视频: http://v.youku.com/v_show/id_XOTM3MzAzMzAw.html...
net2uizoo 创意市集
根据官方电路图制作TI M4的最小系统板时出现的一个问题,求大神解答
按着TI官网给出的TM4C123GH6PM Launchpad的电路图自己焊了2块最小系统,拿直流电源3.3V直接给VCC引脚供电,刚上电时候能用,测试晶振也起振了,但是过了几分钟后就不知不觉短路了,直流电源就过 ......
Linchpin 微控制器 MCU
OV9650 设置1280*1024 出错
大家好,用S3C2440 ARM LINUX 开发板,显示OV9650视频,640*480及以下都正常显示,640*1024也能正常。但只要行超过640就出错。所得的视频缓冲区乱位了,应是右边的图像到左边了。并且有绿色的竖 ......
xiaolu192 嵌入式系统
关于pwm,一个小问题
本帖最后由 基辅之门 于 2014-11-7 21:54 编辑 M1PWM0的基址是PWM1_BASE吗?基址是指发生器吗例如基址是PWM3_BASE?资料里说有4个pwm发生器PWM_GEN_0~3对应PWM0~7 而头文件里只定义有俩基址 ......
基辅之门 微控制器 MCU
双向可控硅工作原理
http://hiphotos.baidu.com/hunansunjianjun/pic/item/e5b4d882b5fa78916d81195f.jpg 请各位大侠帮我分析一下这个双向可控硅是怎样实现双向导通的,多谢了!难道光耦需要给正负脉冲可控硅才 ......
lecat 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 832  188  2362  97  2566  38  47  34  13  8 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved