8KX9 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-28 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 20 ns |
| JESD-30 代码 | R-PDIP-T28 |
| 内存密度 | 73728 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX9 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| MK48H99N-20 | MK48H98N-40 | MK48H99N-40 | MK48H98N-20 | MK48H98N-30 | MK48H99N-30 | |
|---|---|---|---|---|---|---|
| 描述 | 8KX9 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | 8KX9 STANDARD SRAM, 40ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | 8KX9 STANDARD SRAM, 40ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | 8KX9 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | 8KX9 STANDARD SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | 8KX9 STANDARD SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 20 ns | 40 ns | 40 ns | 20 ns | 30 ns | 30 ns |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| 内存密度 | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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