Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not
used.
Crystal connection. If using an external reference, this pin must be left unconnected.
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected either to an external crystal or an external reference clock.
Power supply for the entire chip.
Spread spectrum clock output.
Ground connection.
Rev. 1 | Page 2 of 8 | www.onsemi.com
ASM3P2775A
Modulation Profile
Specifications
Description
Frequency Range
Modulation Equation
Frequency Deviation
Specification
13MHz < CLKIN < 30MHz
F
IN
/640
±1.8% (Typ) @ 14.7MHz
Absolute Maximum Ratings
Symbol
VDD, V
IN
T
STG
T
A
T
s
T
J
T
DV
Storage temperature
Operating temperature
Parameter
Rating
-0.5 to +4.6
-65 to +125
-40 to +85
260
150
2
Unit
V
°
C
°
C
°
C
°
C
KV
Voltage on any pin with respect to Ground
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Operating Conditions
Parameter
VDD
T
A
C
L
C
IN
Supply Voltage
Operating Temperature (Ambient Temperature)
Load Capacitance
Input Capacitance
Description
Min
3.0
0
Max
3.6
+70
15
7
Unit
V
°
C
pF
pF
Rev. 1 | Page 3 of 8 | www.onsemi.com
ASM3P2775A
DC Electrical Characteristics
Symbol
V
IL
V
IH
I
IL
I
IH
I
XOL
I
XOH
V
OL
V
OH
I
DD
I
CC
VDD
t
ON
Z
OUT
Input low voltage
Input high voltage
Input low current
Input high current
XOUT output low current (@ 0.4V, VDD = 3.3V)
XOUT output high current (@ 2.5V, VDD = 3.3V)
Output low voltage (VDD = 3.3 V, I
OL
= 8mA)
Output high voltage (VDD = 3.3 V, I
OH
= 8mA)
Static supply current
Operating voltage
Power-up time (first locked cycle after power-up)
Output impedance
1
1
Parameter
Min
VSS-0.3
2.0
Typ
Max
0.8
VDD+0.3
-35
35
Unit
V
V
µA
µA
mA
mA
3
3
0.4
2.5
10
3.5
3.0
3.3
45
3.6
5
V
V
uA
mA
V
mS
Dynamic supply current (3.3V, 16MHz and no load)
Notes: 1. XIN / CLKIN pin and PD pin are pulled low.
2. VDD and XIN / CLKIN input are stable, PD pin is made high from low.
AC Electrical Characteristics
Symbol
CLKIN
ModOUT
f
d
t
LH
t
HL
1
1
Parameter
Input frequency
Output frequency
Frequency Deviation
Input Frequency = 13MHz
Input Frequency = 30MHz
Min
13
13
Typ
Max
30
30
Unit
MHz
MHz
%
±1.85%
±1.45%
0.5
0.3
1.1
0.8
±200
45
50
1.3
1.0
±300
55
Output rise time (measured from 0.8 to 2.0V)
Output fall time (measured at 2.0V to 0.8V)
Jitter (cycle-to-cycle)
Output duty cycle
nS
nS
pS
%
t
JC
t
D
Note: 1. t
LH
and t
HL
are measured into a capacitive load of 15pF.
Rev. 1 | Page 4 of 8 | www.onsemi.com
ASM3P2775A
Typical Crystal Specifications
Fundamental AT cut parallel resonant crystal
Nominal frequency
Frequency tolerance
Operating temperature range
Storage temperature
Load capacitance
Shunt capacitance
ESR
14.31818MHz
±50ppm or better at 25°
C
-25° to +85°
C
C
-40° to +85°
C
C
18pF
7pF maximum
25
Ω
Note: C
L
is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency.
Typical Crystal Interface Circuit
R
Crystal
XIN
C
L
Rx
XOUT
C
L
C
L
= 2*(C
P
– C
S
),
Where C
P
= Load capacitance of crystal from crystal vendor datasheet.
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