Crystal Connection or External Reference Clock Input
Connection for an External Crystal. If using an External Reference, this Pin must be Left
Unconnected
Ground to Entire Chip
Spread Selection Input. Has an Internal Pull-Up Resistor
Modulated Clock Output
Power Supply for the Entire Chip
Frequency Selection Bit. This Pin Selects the Frequency Range of Operation (See Table 2).
Has an Internal Pull-Up Resistor
No Connect
Table 2. FREQUENCY RANGE SELECTION
FS
0
1
Frequency Range (MHz)
6−10
18−30
www.onsemi.com
2
ASM3P2180A
Table 3. SPREAD SELECTION
Frequency (MHz)
SS%
0
FS = 0
6
8
10
1
6
8
10
FS = 1
18
24
30
18
24
30
Deviation (%) (Typ)
−2
−1.5
−1
−4
−3
−2
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol
VDD, V
IN
T
STG
T
S
T
J
T
DV
Parameter
Voltage on any Pin with Respect to Ground
Storage Temperature
Maximum Soldering Temperature (10 s)
Junction Temperature
Static Discharge Voltage (as per JEDEC STD22−A114−B)
Rating
−0.5 to +4.6
−60 to +125
260
150
2
Unit
V
°C
°C
°C
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 5. RECOMMENDED OPERATING CONDITIONS
Parameter
VDD
T
A
C
L
C
IN
Supply Voltage
Operating Temperature (Ambient Temperature)
Load Capacitance
Input Capacitance
Description
Min
2.8
−40
−
−
Max
3.7
+85
15
4
Unit
V
°C
pF
pF
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 6. DC ELECTRICAL CHARACTERISTICS
Symbol
V
IL
V
IH
I
IL
I
IH
I
XOL
I
XOH
V
OL
V
OH
I
CC
I
DD
*
V
DD
t
ON
Z
OUT
Input Low Voltage
Input High Voltage
Input Low Current (Pull-Up Resistors on Inputs SS%, FS)
Input High Current
X
OUT
Output Low Current (@ 0.4 V, V
DD
= 3.3 V)
X
OUT
Output High Current (@ 2.5 V, V
DD
= 3.3 V)
Output Low Voltage (V
DD
= 3.3 V, I
OL
= 4 mA)
Output High Voltage (V
DD
= 3.3 V, I
OH
= 4 mA)
Dynamic Supply Current Normal Mode
(3.3 V and 10 pF Loading)
Static Supply Current Standby Mode
Operating Voltage
Power-Up Time (First Locked Clock Cycle after Power-Up)
Clock Output Impedance
Parameter
Min
GND − 0.3
2.0
−
−
−
−
−
2.5
10
−
2.8
−
−
Typ
−
−
−
−
3
4
−
−
15
−
3.3
0.18
50
Max
0.8
V
DD
+ 0.3
−27
18
−
−
0.4
−
25
7
3.7
−
−
Unit
V
V
mA
mA
mA
mA
V
V
mA
mA
V
ms
W
* CLKIN pin pulled to GND.
www.onsemi.com
3
ASM3P2180A
Table 7. AC ELECTRICAL CHARACTERISTICS
Symbol
CLKIN
Input Frequency
FS = 0
FS = 1
Output Frequency
FS = 0
FS = 1
Output Rise Time (Measured at 0.8 V to 2.0 V)
Output Fall Time (Measured at 2.0 V to 0.8 V)
Jitter (Cycle to Cycle)
Output Duty Cycle
Parameter
Min
6
18
6
18
1.2
0.8
−
45
Typ
−
−
−
−
1.3
0.9
±325
50
Max
10
30
MHz
10
30
1.4
1.0
−
55
ns
ns
ps
%
Unit
MHz
CLKOUT
t
LH
*
t
HL
*
t
JC
t
D
* t
LH
and t
HL
are measured into a capacitive load of 15 pF.
+3.3 V
Crystal
XIN
C1
XOUT
CLKOUT
C2
GND
VDD
0.1
mF
Spread Spectrum Output
(EMI Suppressed)
C
LOAD
Figure 3. Typical Test Circuit
Table 8. ORDERING INFORMATION
Part Number
ASM3P2180AF-08SR
Marking
ACT
Package
SOIC−8 NB
(Pb-Free)
Temperature
0 to 70°C
Shipping
†
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure,
BRD8011/D.
www.onsemi.com
4
ASM3P2180A
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
A
8
5
−X−
B
1
4
S
0.25 (0.010)
M
Y
M
−Y−
G
C
−Z−
H
D
0.25 (0.010)
M
SEATING
PLANE
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
DIM
A
B
C
D
G
H
J
K
M
N
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
_
8
_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0
_
8
_
0.010
0.020
0.228
0.244
N
X 45
_
0.10 (0.004)
M
Z Y
S
J
X
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm
inches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at
www.onsemi.com/site/pdf/Patent−Marking.pdf.
ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
