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TKC-HTC-1206LF-3M30-J

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.2W, 3300000ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE
产品类别无源元件    电阻器   
文件大小344KB,共2页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
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TKC-HTC-1206LF-3M30-J概述

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 3300000ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE

TKC-HTC-1206LF-3M30-J规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称TT Electronics plc
包装说明SMT, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
构造Chip
JESD-609代码e3
制造商序列号HTC
安装特点SURFACE MOUNT
端子数量2
最高工作温度200 °C
最低工作温度-55 °C
封装高度0.7 mm
封装长度3.2 mm
封装形状RECTANGULAR PACKAGE
封装形式SMT
封装宽度1.6 mm
额定功率耗散 (P)0.2 W
额定温度150 °C
电阻3300000 Ω
电阻器类型FIXED RESISTOR
系列HTC
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差5%
工作电压200 V

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gh Temperature
High Temperature
hick Film Chip Resistors
Excellent high temperature stability
eration to
·
200°C
High Temperature
HTC Series
Thick
Film Chip Resistors
Thick
Film Chip Resistors
C Series
Operation to 200°C
·
·
·
·
Thick Film Chip Resistors
High Temperature
Improved working
ellent high temperature stability
voltage ratings
HTC Series
Pb-free
ratings
oved working voltage
wrap-around terminations
HTC Series
Standard chip sizes available from 1206 to 2512
Operation to 200°C
ree wrap-around terminations
Operation to 200°C
Excellent high temperature stability
dard chip sizes available from 1206 to 2512
Excellent high temperature stability
Improved working voltage ratings
Improved working voltage ratings
Pb-free wrap-around terminations
Pb-free wrap-around terminations
Standard chip sizes available from 1206 to 2512
Standard chip sizes available from 1206 to 2512
ctrical Data
Electrical Data
acteristic
Electrical Data
Characteristic
Characteristic
Resistance Range
Resistance Range
150°C Power Rating
150°C Power Rating
1206
1206
1206
2010
1
to 10M
2010
±1%, ±5%
2512
2512
2512
2010
stance Range
1
±1%, ±5%
10
1
to
to
to 10M
±1%, ±5%
1M ±0.5%, ±5%, ±1%
10M
C Power Rating
200mW
200V
10 to 1M ±0.5%, ±5%, ±1%
10 to 1M ±0.5%, ±5%, ±1%
200mW
200mW
200V
200V
500mW
400V
500mW
500mW
750mW
750mW
750mW
Voltage Rating
Voltage Rating
Max
Max Voltage Rating
400V
400V
± 100ppm/°C
± 100ppm/°C
± 100ppm/°C
-55°C
-55°C to
to +200°C
+200°C
500V
500V
500V
Absolute TCR
olute TCR
Absolute TCR
Operating Temperature
80mm
2
80mm
2
Operating
ating Temperature
Temperature
-55°C to +200°C
200mm
2
200mm
2
300mm
2
300mm
2
Trace Area
1
Pad/Trace Area
1
Pad/Trace Area
1
Termination
Termination
80mm
2
Wrap-around Pb-free with leach resistant Ni barrier
Wrap-around Pb-free with leach resistant Ni barrier
200mm
2
300mm
2
mination
Note
1
: Recommended minimum pad and adjacent trace area
Wrap-around
for rated power on
FR4 PCB.
for each termination
Note
1
: Recommended minimum pad and adjacent trace area for each termination for
Pb-free with
PCB.
rated power on
FR4
leach
resistant Ni barrier
ecommended minimum pad and adjacent trace area for each termination for rated power on
FR4 PCB.
Environmental Data
Environmental Data
vironmental Data
Test
Test
Load Life
Load Life
High Temperature Exposure
High Temperature Exposure
Method
Method
MIL-STD-202 Method 108
MIL-STD-202 Method 108
(Rated Power for 1000hrs
150°C)
(Rated
Method
1000hrs @
@ 150°C)
Power for
1000 hours
200°C
1000 hours @
@ 200°C
Specification
Specification
Maximum
2
Maximum
2
Typical
Typical
Specification
1.00%
0.25%
1.00%
0.25%
Maximum
2
1.00%
1.00%
Typical
0.20%
0.20%
0.10%
0.25%
0.10%
0.25%
0.25%
0.20%
0.05%
0.05%
Life
Short Time Overload
Short Time Overload
MIL-STD-202 Method 108
MIL-PRF-55342H
MIL-PRF-55342H
(6.25X rated power
5secs)
(Rated Power for
rated power
@
for 5secs)
(6.25X
1000hrs
for
150°C)
MIL-STD-202
200°C
106G
1000
MIL-STD-202 Method 106G
hours @
Method
1.00%
1.00%
1.00%
1.00%
1.00%
1.00%
0.25%
0.25%
Moisture Resistance
Moisture Resistance
Temperature Exposure
Thermal Shock
Thermal Shock
Resistance to Soldering Heat
t Time Overload
Resistance to Soldering Heat
MIL-PRF-55342H
MIL-STD-202 Method 210F
MIL-STD-202 Method 210F
(6.25X rated power for 5secs)
MIL-STD-202 Method 208
MIL-STD-202 Method 106G
(245°C, 5 seconds)
MIL-STD-202 Method 107G Condition
MIL-STD-202 Method 107G Condition B
B
1.00%
0.25%
0.25%
0.10%
0.05%
0.05%
Solderability
ture Resistance
Solderability
2
2
MIL-STD-202 Method 208
(245°C, 5 seconds)
>95% Coverage
1.00%
Coverage
0.25%
>95%
Note
0.01 added for all resistance values <10.
mal Shock
Note
:
:
0.01 added for all resistance values <10.
MIL-STD-202 Method 107G Condition B
0.25%
0.25%
0.05%
0.05%
A subsidiary of
A subsidiary of
TTelectronics plc
TTelectronics plc
HTC Series Issue July
HTC Series Issue July 2009
2009
General Note
General Note
Heat
stance to Soldering
right
to make changes in
in product specification without notice
liability.
MIL-STD-202 Method 210F
IRC reserves the
IRC reserves the right
to make changes
product specification without notice or
or liability.
information is subject to IRC’s own data and
considered accurate at time of
of going to print.
General Note
All information is subject to IRC’s own data and is
is considered accurate at time
going to print.
erability
MIL-STD-202 Method 208
All information
992
7900 •
Facsimile: 361 992
own data
Website:
considered accurate at time of going to print.
is subject to
Facsimile: 361 992 3377 •
and is
www.irctt.com
TT electronics’
3377 •
Website: www.irctt.com
Telephone: 361
Telephone: 361 992
7900
(245°C, 5 seconds)
TT electronics reserves the right
Advanced Film Division
to make changes in product specification without notice or liability.
4222 South Staples Street
Corpus Christi Texas 78411 USA
Advanced Film Division
4222 South Staples Street •
• Corpus Christi Texas 78411 USA
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
>95% Coverage
©
all resistance
plc
0.01 added for
TT electronics
values <10.
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