DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
包装说明 | SOP, SOP16,.25 |
Reach Compliance Code | not_compliant |
其他特性 | IT CAN ALSO OPERATE FROM 5V TO 34V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 9.9 mm |
湿度敏感等级 | 1 |
负电源电压最大值(Vsup) | -20 V |
负电源电压最小值(Vsup) | -5 V |
标称负供电电压 (Vsup) | -15 V |
正常位置 | NO |
信道数量 | 1 |
功能数量 | 2 |
端子数量 | 16 |
标称断态隔离度 | 72 dB |
通态电阻匹配规范 | 3 Ω |
最大通态电阻 (Ron) | 45 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出 | SEPARATE OUTPUT |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 240 |
电源 | 5,+-15 V |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 20 V |
最小供电电压 (Vsup) | 5 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
最长断开时间 | 100 ns |
最长接通时间 | 150 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
DG401DY | DG403DY | DG401DY-T | DG403DY-T | |
---|---|---|---|---|
描述 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO16 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
包装说明 | SOP, SOP16,.25 | SOIC-16 | SOP, SOP16,.25 | SOIC-16 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
模拟集成电路 - 其他类型 | SPST | SPDT | SPST | SPDT |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
正常位置 | NO | NO/NC | NO | NO/NC |
信道数量 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 |
标称断态隔离度 | 72 dB | 72 dB | 72 dB | 72 dB |
通态电阻匹配规范 | 3 Ω | 3 Ω | 3 Ω | 3 Ω |
最大通态电阻 (Ron) | 45 Ω | 45 Ω | 45 Ω | 45 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP |
封装等效代码 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | YES | YES |
最长断开时间 | 100 ns | 100 ns | 100 ns | 100 ns |
最长接通时间 | 150 ns | 150 ns | 150 ns | 150 ns |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
器件名 | 厂商 | 描述 |
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