IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电流 (Isup) | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| LM3710XQMMX-308/NOPB | LM3710XKMMX-232 | LM3710XKMMX-463 | LM3710YQMMX-232 | LM3710YQMM-232/NOPB | LM3710XKMM-463/NOPB | LM3710XKMM-463 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO10, MSOP-10, Power Management Circuit |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | TSSOP, TSSOP10,.19,20 | MSOP-10 | MSOP-10 | MSOP-10 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | MSOP-10 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e3 | e0 | e0 | e0 | e3 | e3 | e0 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1/5.5 V | 1/5.5 V | 1/5.5 V | 1/5.5 V | 1/5.5 V | 1/5.5 V | 1/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电流 (Isup) | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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