1.8W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, BGA-9
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, |
| 针数 | 9 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 1% |
| JESD-30 代码 | S-PBGA-B9 |
| JESD-609代码 | e1 |
| 长度 | 1.463 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 1.8 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.675 mm |
| 最大供电电压 (Vsup) | 9 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.463 mm |
| LM4951TL | LM4951SD-NOPB | LM4951TL-NOPB | LM4951SDX-NOPB | LM4951SD/NOPB | LM4951TL/NOPB | LM4951SDX/NOPB | LM4951 | LM4951TLX | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1.8W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, BGA-9 | Audio Amplifiers Wide Vtg Range 1.8W Audio Pwr Amp | Audio Amplifiers Wide Voltage Range 1.8 Watt Audio Power Amplifier 9-DSBGA | Audio Amplifiers Y | Wide Voltage Range 1.8 Watt Audio Power Amplifier 10-WSON | Audio Amplifiers Wide Voltage Range 1.8 Watt Audio Power Amplifier 9-DSBGA | Wide Voltage Range 1.8 Watt Audio Power Amplifier 10-WSON | LM4951 Wide Voltage Range 1.8 Watt Audio Power Amplifier | 1.8W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, BGA-9 |
| 是否Rohs认证 | 符合 | - | - | - | 符合 | 符合 | 符合 | - | 符合 |
| 包装说明 | VFBGA, | - | - | - | HVSON, SOLCC10,.11,20 | FBGA, BGA9,3X3,20 | HVSON, SOLCC10,.11,20 | - | VFBGA, |
| Reach Compliance Code | compliant | - | - | - | compliant | compliant | compliant | - | compliant |
| ECCN代码 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 商用集成电路类型 | AUDIO AMPLIFIER | - | - | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER |
| JESD-30 代码 | S-PBGA-B9 | - | - | - | S-PDSO-N10 | S-PBGA-B9 | S-PDSO-N10 | - | S-PBGA-B9 |
| JESD-609代码 | e1 | - | - | - | e3 | e1 | e3 | - | e1 |
| 湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 | - | 1 |
| 功能数量 | 1 | - | - | - | 1 | 1 | 1 | - | 1 |
| 端子数量 | 9 | - | - | - | 10 | 9 | 10 | - | 9 |
| 最高工作温度 | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | - | - | HVSON | FBGA | HVSON | - | VFBGA |
| 封装形状 | SQUARE | - | - | - | SQUARE | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | - | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 表面贴装 | YES | - | - | - | YES | YES | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER | - | - | - | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | - | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | - | - | - | NO LEAD | BALL | NO LEAD | - | BALL |
| 端子节距 | 0.5 mm | - | - | - | 0.8 mm | 0.5 mm | 0.8 mm | - | 0.5 mm |
| 端子位置 | BOTTOM | - | - | - | DUAL | BOTTOM | DUAL | - | BOTTOM |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
