MIH Series
5mm X 7mm Ceramic SMD
• Ceramic SMD Package
• 5.0, 3.3, 2.5, and 1.8 Volt
• HCMOS/TTL Compatible Output
• Stability to ±10ppm
• Tape and Reel Packaging
Electrical Specifications
Frequency Range
Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging)
Operating Temperature Range
Storage Temperature Range
Supply Voltage (Vdd)
±5%
Supply Current
Vdd = 5V
Vdd = 3.3V
Vdd = 2.5V
Vdd = 1.8V
Output Voltage HCMOS
Logic “0”
Logic “1”
Duty Cycle
50% of waveform
Load Drive Capability
Rise / Fall Time
Start Up Time
Jitter
Peak to Peak
RMS
*Please contact your MMD representative for up-to-date typical jitter information
1.500MHz to 156.250MHz(1.8V to 80MHz)
±100ppm to ±10ppm
0°C - 70°C to -40°C - 85°C
-55°C - 125°C
5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc
70mA max.
40mA max.
35mA max.
15mA max.
10% Vdd max.
90% Vdd min.
40%/60% max. or 45%/55% max.
10 TTL Gates or 50pF Load max.
4nSec max.
10mSec max.
150pSec max.*
25pSec max.*
www.mmdcomp.com
Toll Free 1-877-663-2667 / Fax: 949-753-5889
Specifications subject to change without notice
OS11
Revision: 09/18/02 G
Part Numbering Guide
MI
5X7 Ceramic SMD
H
Frequency Stability
100 = ±100ppm
050 = ±50ppm
025 = ±25ppm
020 = ±20ppm
015 = ±15ppm
010 = ±10ppm**
Operating Temperature
Blank = 0°C to 70°C
27 = -20°C to 70°C**
48 = -40°C to 85°C
Output
H = HCMOS
H
Frequency
Pin 1 Connection
H = Tri-state
T&R
Supply Voltage
Blank = 5 Volt
3 = 3.3 Volt
2 = 2.5 Volt
1 = 1.8 Volt
Packaging*
Blank = Bulk
T&R = Tape and Reel
Symmetry
Blank = 40%/60%
A = 45%/55%
*See page VA4 for Tape Specifications
**Not available in 2.5V and 1.8V
Mechanical Dimensions
2.6 ±0.15
.102 ±.006
4
1
3.68 ±0.15
.145 ±.006
2.88
.113
4
5.0 ±0.2
.197 ±.008
7.0 ±0.2
.278 ±.008
3
1.7 max
.067 max
5.08 ±0.15
.200 ±.006
1.2 ±0.2
.047 ±.008
2
1.4 ±0.1
.055 ±.004
Markings
1
3
2
Pad Connections
Tri-state Operation
Logic 1 or NC = Oscillation
Logic 0 or GND = High Impedance
Suggested Solder Pad Layout
Pin 2: Ground / Case
Pin 3: Output
P i n 4 : S u p p l y Vo l ta g e
2.0
.079
2.2
.087
Environmental / Mechanical
Markings
Shock: MIL-STD-883, Method 2002, Condition B
Solderability: MIL-STD-883, Method 2003
Solvent Resistance: MIL-STD-202, Method 215
Vibration: MIL-STD-883, Method 2007, Condition A
Gross Leak Test: MIL-STD-883, Method 1014, Condition C
Fine Leak Test: MIL-STD-883, Method 1014, Condition A2
Line 1: MMD “Date Code”
Line 2: Frequency
www.mmdcomp.com
Toll Free 1-877-663-2667 / Fax: 949-753-5889
OS11
Specifications subject to change without notice
Revision: 09/18/02 G
1.81
.071
P i n 1 : Tr i - Sta t e
Solder Pad
(X4)
微控制器 MCU
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