电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

LH28F800SGHN-L100

产品描述Flash, 512KX16, 100ns, PDSO44, 28.20 X 16 MM, PLASTIC, SOP-44
产品类别存储    存储   
文件大小1MB,共48页
制造商SHARP
官网地址http://sharp-world.com/products/device/
下载文档 详细参数 选型对比 全文预览

LH28F800SGHN-L100概述

Flash, 512KX16, 100ns, PDSO44, 28.20 X 16 MM, PLASTIC, SOP-44

LH28F800SGHN-L100规格参数

参数名称属性值
厂商名称SHARP
包装说明28.20 X 16 MM, PLASTIC, SOP-44
Reach Compliance Codeunknown
最长访问时间100 ns
其他特性USER SELECTABLE 3.3V VCC
JESD-30 代码R-PDSO-G44
内存密度8388608 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量44
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行PARALLEL
编程电压3 V
认证状态Not Qualified
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术MOS
温度等级INDUSTRIAL
端子形式GULL WING
端子位置DUAL
类型NOR TYPE

LH28F800SGHN-L100相似产品对比

LH28F800SGHN-L100 LH28F800SGB-L100 LH28F800SGHE-L100 LH28F800SGHB-L100 LH28F800SGHR-L100 LH28F800SGR-L100 LH28F800SGE-L100 LH28F800SGN-L100 LH28F800SGHN-L70
描述 Flash, 512KX16, 100ns, PDSO44, 28.20 X 16 MM, PLASTIC, SOP-44 Flash, 512KX16, PBGA48, 8 X 8 MM, 0.80 MM PITCH, PLASTIC, CSP-48 Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP-48 Flash, 512KX16, 100ns, PBGA48, 8 X 8 MM, 0.80 MM PITCH, PLASTIC, CSP-48 Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-48 Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-48 Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP-48 Flash, 512KX16, PDSO44, 28.20 X 16 MM, PLASTIC, SOP-44 Flash, 512KX16, 80ns, PDSO44, 28.20 X 16 MM, PLASTIC, SOP-44
厂商名称 SHARP SHARP SHARP SHARP SHARP SHARP SHARP SHARP SHARP
包装说明 28.20 X 16 MM, PLASTIC, SOP-44 8 X 8 MM, 0.80 MM PITCH, PLASTIC, CSP-48 12 X 20 MM, 1.20 MM HEIGHT, TSOP-48 8 X 8 MM, 0.80 MM PITCH, PLASTIC, CSP-48 12 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-48 12 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-48 12 X 20 MM, 1.20 MM HEIGHT, TSOP-48 28.20 X 16 MM, PLASTIC, SOP-44 28.20 X 16 MM, PLASTIC, SOP-44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
其他特性 USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC USER SELECTABLE 3.3V VCC
JESD-30 代码 R-PDSO-G44 S-PBGA-B48 R-PDSO-G48 S-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G44 R-PDSO-G44
内存密度 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1 1
端子数量 44 48 48 48 48 48 48 44 44
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C - - - -40 °C
组织 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP BGA SOP BGA SOP SOP SOP SOP SOP
封装形状 RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE GRID ARRAY SMALL OUTLINE GRID ARRAY SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 MOS MOS MOS MOS MOS MOS MOS MOS MOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子形式 GULL WING BALL GULL WING BALL GULL WING GULL WING GULL WING GULL WING GULL WING
端子位置 DUAL BOTTOM DUAL BOTTOM DUAL DUAL DUAL DUAL DUAL
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
最长访问时间 100 ns - 100 ns 100 ns 100 ns 100 ns 100 ns - 80 ns
谁有LM3S万年历的历程呀?
谁有LM3S万年历的历程呀?...
o0pingu0o 微控制器 MCU
spi总线隔离
单片机spi总线隔离用什么器件比较合适,且耗电小...
lilove751 嵌入式系统
vhdl编译错误
LIBRARY ieee;USE ieee.std_logic_1164.all;USE ieee.std_logic_unsigned.all;ENTITY fdiv2 ISPORT (CLK: IN STD_LOGIC;PM: OUT STD_LOGIC;D: IN STD_LOGIC_VECTOR(3 DOWNTO 0);DOUT: OUT STD_LOGIC_VECTOR(3 DOWNTO...
杭州康芯小马 Altera SoC
有点困惑呢
最近打算开始学习嵌入式系统,打算开始学习linux,但是发现linux的版本非常的多,于是非常的困惑,希望大家给点意见!哪个版本的更加适合初学者呢?...
张无忌1987 嵌入式系统
simulator时遇到Trouble running Target CPU错误提示。
我在用ccs2.2进行开发的时候,程序在硬仿真环境下是可以仿真,都很正常。但是若在若仿真环境下,程序只能编译和load。之后,在执行go main操作时出现以下错误提示:Trouble running Target CPU: Invalid Destination port address in the trpThe Trp ignored .. QCOMP sent Destination Ad...
youqing20000 DSP 与 ARM 处理器

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 234  549  783  1532  1589 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved