IC 1 CHANNEL(S), 10M bps, LOCAL AREA NETWORK CONTROLLER, PQFP80, PLASTIC, QFP-80, Serial IO/Communication Controller
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | QFP |
包装说明 | QFP, |
针数 | 80 |
Reach Compliance Code | unknown |
地址总线宽度 | 4 |
边界扫描 | NO |
数据编码/解码方法 | BIPH-LEVEL(MANCHESTER) |
最大数据传输速率 | 1.25 MBps |
外部数据总线宽度 | 16 |
JESD-30 代码 | R-PQFP-G80 |
JESD-609代码 | e3 |
长度 | 20 mm |
低功率模式 | NO |
串行 I/O 数 | 1 |
端子数量 | 80 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
座面最大高度 | 3.3 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
宽度 | 14 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NE86950BB-T | NE86950BA | NE86950BA-T | NE86950BB | |
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描述 | IC 1 CHANNEL(S), 10M bps, LOCAL AREA NETWORK CONTROLLER, PQFP80, PLASTIC, QFP-80, Serial IO/Communication Controller | IC 1 CHANNEL(S), 10M bps, LOCAL AREA NETWORK CONTROLLER, PQCC84, PLASTIC, LCC-84, Serial IO/Communication Controller | IC 1 CHANNEL(S), 10M bps, LOCAL AREA NETWORK CONTROLLER, PQCC84, PLASTIC, LCC-84, Serial IO/Communication Controller | IC 1 CHANNEL(S), 10M bps, LOCAL AREA NETWORK CONTROLLER, PQFP80, PLASTIC, QFP-80, Serial IO/Communication Controller |
零件包装代码 | QFP | LCC | LCC | QFP |
包装说明 | QFP, | QCCJ, | QCCJ, | QFP, |
针数 | 80 | 84 | 84 | 80 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
地址总线宽度 | 4 | 4 | 4 | 4 |
边界扫描 | NO | NO | NO | NO |
数据编码/解码方法 | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) |
最大数据传输速率 | 1.25 MBps | 1.25 MBps | 1.25 MBps | 1.25 MBps |
外部数据总线宽度 | 16 | 16 | 16 | 16 |
JESD-30 代码 | R-PQFP-G80 | S-PQCC-J84 | S-PQCC-J84 | R-PQFP-G80 |
长度 | 20 mm | 29.3116 mm | 29.3116 mm | 20 mm |
低功率模式 | NO | NO | NO | NO |
串行 I/O 数 | 1 | 1 | 1 | 1 |
端子数量 | 80 | 84 | 84 | 80 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QCCJ | QCCJ | QFP |
封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
封装形式 | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.3 mm | 4.57 mm | 4.57 mm | 3.3 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | J BEND | J BEND | GULL WING |
端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
宽度 | 14 mm | 29.3116 mm | 29.3116 mm | 14 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, LAN | SERIAL IO/COMMUNICATION CONTROLLER, LAN | SERIAL IO/COMMUNICATION CONTROLLER, LAN | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
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