TITLE:
SPECIFICATION CONTROL DRAWING
PART IDENTIFIER:
SMT3737TALNF
DESCRIPTION:
SURFACE MOUNT TERMINATION, TUNED FOR TELECOM BAND, LEAD FREE
ASSEMBLY DWG:
1102054
1.0
SPECIFICATIONS:
1.1
ELECTRICAL:
1.1.1
IMPEDANCE: 50Ω NOMINAL.
1.1.2
FREQUENCY: 800 MHZ – 2700 MHZ.
1.1.3
VSWR: 1.20:1 MAX.
1.1.4
INPUT POWER:
1.1.4.1 100 WATTS. CHIP SOLDERED TO MOUNTING SURFACE. MOUNTING SURFACE TEMPERATURE
MAINTAINED AT 100
°C
MAXIMUM. APPLY LINEAR DE-RATING OF INPUT POWER TO 0 WATTS
AT 150
°C.
MECHANICAL:
1.2.1
OUTLINE DWG: SEE SHEET 2.
1.2.2
WORKMANSHIP: PER MIL-PRF-55342
1.2.3
THERMAL IMPEDANCE (R
Θ
)
1.2.3.1 0.500
°C
/ WATT R
Θ
FROM RESIST FILM TO MOUNTING SURFACE DIRECTLY UNDER CENTER OF CHIP.
CHIP SOLDERED DIRECTLY TO MOUNTING SURFACE.
1.2.4
FILM TEMPERATURE (T
F
)
1.2.4.1 200
°C
ABSOLUTE MAXIMUM FILM TEMPERATURE. DE-RATE TO 150
°C
MAXIMUM FILM TEMPERATURE
FOR ALL MILITARY/HIGH-RELIABILITY APPLICATIONS.
1.2.5
THERMAL
1.2.5.1 DETERMINE MAXIMUM MOUNTING SURFACE TEMPERATURE BY APPLYING THE FOLLOWING FORMULA:
T
S
= T
F
- (P
MAX
X R
Θ
)
WHERE: T
S
= MAXIMUM MOUNTING SURFACE TEMPERATURE
T
F
= MAXIMUM FILM TEMPERATURE
P
MAX
= MAXIMUM APPLIED INPUT POWER
R
Θ
= CHIP THERMAL IMPEDANCE.
1.3
ENVIRONMENTAL:
1.3.1
TEMPERATURE RANGE:
1.3.1.1 NON-OPERATING: -55
°C
TO +150
°C.
1.3.1.2 OPERATING: -55 °C TO +150 °C.
1.2
2.0
3.0
UNIT MARKING:
NONE.
QUALITY ASSURANCE:
3.1
SAMPLE INSPECT PER ANSI/ASQC Z1.4 GENERAL INSPECTION, LEVEL II, AQL = 1.0.
3.1.1
VISUAL AND MECHANICAL PER 824W154.
3.1.2
3.2
DC RESISTANCE: 50Ω
±
5%.
DATA REQUIREMENTS:
3.2.1
NO TEST DATA REQUIRED FOR CUSTOMER.
3.2.2
DATA RETENTION – 24 MONTHS.
STANDARD PACKING PER 755W002.
4.0
PACKAGING:
EMC TECHNOLOGY
8851 SW OLD KANSAS AVE.
STUART, FL 34997
CAGE CODE # 24602
CHANGE NOTICE
EN 09-F0852
DWG #
REV LVL
SHEET
1010675000
B
1
OF
2
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