Important notice
Dear Customer,
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DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
MBD127
BZA800AVL series
Quadruple low capacitance ESD
suppressor
Product data sheet
Supersedes data of 2003 Apr 01
2003 Oct 20
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
FEATURES
•
Low diode capacitance
•
Low leakage current
•
SOT353 (SC-88A) surface mount package
•
Common anode configuration.
APPLICATIONS
•
Communication systems
•
Computers and peripherals
•
Audio and video equipment.
DESCRIPTION
Monolithic transient voltage suppressor diode in a five lead
SOT353 (SC-88A) package for 4-bit wide ESD transient
suppression.
MARKING
TYPE NUMBER
BZA856AVL
BZA862AVL
BZA868AVL
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
BZA856AVL
BZA862AVL
BZA868AVL
−
−
−
DESCRIPTION
plastic surface mounted package; 5 leads
plastic surface mounted package; 5 leads
plastic surface mounted package; 5 leads
MARKING CODE
R3
R2
R1
Fig.1
1
2
3
5
handbook, halfpage
4
BZA800AVL series
PINNING
PIN
1
2
3
4
5
cathode 1
common anode
cathode 2
cathode 3
cathode 4
DESCRIPTION
1
3
2
4
5
MGT580
Simplified outline (SOT353; SC-88A) and
symbol.
VERSION
SOT353
SOT353
SOT353
2003 Oct 20
2
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
I
Z
I
F
I
FSM
P
tot
P
ZSM
T
stg
T
j
ESD
working current
continuous forward current
non-repetitive peak forward current
total power dissipation
non repetitive peak reverse power
dissipation
storage temperature
junction temperature
electrostatic discharge
HBM MIL-Std 883
Notes
1. DC working current limited by P
tot(max)
.
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
STANDARD
IEC 61000-4-2, level 4 (ESD)
HBM MIL-Std 883, class 3
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
R
th j-s
PARAMETER
thermal resistance from junction to
ambient
thermal resistance from junction to
solder point; note 1
CONDITIONS
all diodes loaded
one diode loaded
all diodes loaded
>4 kV
T
amb
= 25
°C
T
amb
= 25
°C
t
p
= 1 ms; square pulse
T
amb
= 25
°C;
note 2; see Fig.5
square pulse; t
p
= 1 ms
PARAMETER
CONDITIONS
BZA800AVL series
MIN.
−
−
−
−
−
−65
−
MAX.
UNIT
note 1
200
3.5
300
6
+150
150
−
−
mA
mA
A
mW
W
°C
°C
kV
kV
IEC 61000-4-2 (contact discharge) 15
10
CONDITIONS
>15 kV (air); >8 kV (contact discharge)
VALUE
410
200
185
UNIT
K/W
K/W
K/W
Note
1. Solder point of common anode (pin 2).
2003 Oct 20
3
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
V
F
I
R
PARAMETER
forward voltage
reverse current
BZA856AVL
BZA862AVL
BZA868AVL
V
Z
working voltage
BZA856AVL
BZA862AVL
BZA868AVL
r
dif
differential resistance
BZA856AVL
BZA862AVL
BZA868AVL
S
Z
temperature coefficient
BZA856AVL
BZA862AVL
BZA868AVL
C
d
diode capacitance
BZA856AVL
BZA862AVL
BZA868AVL
diode capacitance
BZA856AVL
BZA862AVL
BZA868AVL
I
ZSM
non-repetitive peak reverse current
BZA856AVL
BZA862AVL
BZA868AVL
t
p
= 1 ms; T
amb
= 25
°C
−
−
−
f = 1 MHz; V
R
= 5 V
−
−
−
f = 1 MHz; V
R
= 0
−
−
−
I
Z
= 1 mA
−
−
−
I
Z
= 1 mA
−
−
−
V
R
= 3 V
V
R
= 4 V
V
R
= 4.3 V
I
Z
= 1 mA
5.32
5.89
6.46
−
−
−
CONDITIONS
I
F
= 200 mA
−
MIN.
BZA800AVL series
TYP.
−
−
−
−
5.6
6.2
6.8
−
−
−
1.3
2.4
2.9
22
18
16
12
9
8
−
−
−
MAX.
1.2
200
100
20
5.88
6.51
7.14
200
150
100
−
−
−
28
22
19
17
12
11
0.90
0.85
0.80
UNIT
V
nA
nA
nA
V
V
V
Ω
Ω
Ω
mV/K
mV/K
mV/K
pF
pF
pF
pF
pF
pF
A
A
A
2003 Oct 20
4
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