Operational Amplifier, 2 Func, 230uV Offset-Max, BIPolar, CDIP14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Calogic |
零件包装代码 | DIP |
包装说明 | DIP, DIP14,.3 |
针数 | 14 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
25C 时的最大偏置电流 (IIB) | 0.0056 µA |
频率补偿 | YES |
最大输入失调电压 | 230 µV |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
低-失调 | YES |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 2 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | +-15 V |
认证状态 | Not Qualified |
供电电压上限 | 22 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
最小电压增益 | 150000 |
OP207AY | OP207EY | OP207FY | OP207BY | |
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描述 | Operational Amplifier, 2 Func, 230uV Offset-Max, BIPolar, CDIP14 | Operational Amplifier, 2 Func, 200uV Offset-Max, BIPolar, CDIP14 | Operational Amplifier, 2 Func, 350uV Offset-Max, BIPolar, CDIP14 | Operational Amplifier, 2 Func, 400uV Offset-Max, BIPolar, CDIP14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Calogic | Calogic | Calogic | Calogic |
零件包装代码 | DIP | DIP | DIP | DIP |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
针数 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
25C 时的最大偏置电流 (IIB) | 0.0056 µA | 0.005 µA | 0.011 µA | 0.014 µA |
频率补偿 | YES | YES | YES | YES |
最大输入失调电压 | 230 µV | 200 µV | 350 µV | 400 µV |
JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 |
低-失调 | YES | YES | YES | YES |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
功能数量 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
供电电压上限 | 22 V | 22 V | 22 V | 22 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
最小电压增益 | 150000 | 150000 | 120000 | 120000 |
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