4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 标称负供电电压 (Vsup) | -6 V |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 标称断态隔离度 | 40 dB |
| 最大通态电阻 (Ron) | 140 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 2/12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电流 (Isup) | 0.16 mA |
| 标称供电电压 (Vsup) | 6 V |
| 表面贴装 | YES |
| 最长断开时间 | 15 ns |
| 最长接通时间 | 15 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| MC74HC4352DW | MC54HC4352J | MC74HC4352N | MC74HC4352DWR2 | |
|---|---|---|---|---|
| 描述 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP20, CERAMIC, DIP-20 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP20, PLASTIC, DIP-20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20, SOIC-20 |
| 包装说明 | SOP, SOP20,.4 | DIP, | DIP, DIP20,.3 | SOP, SOP20,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G20 | R-CDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 12.8 mm | 24.515 mm | 26.415 mm | 12.8 mm |
| 标称负供电电压 (Vsup) | -6 V | -6 V | -6 V | -6 V |
| 信道数量 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 标称断态隔离度 | 40 dB | 40 dB | 40 dB | 40 dB |
| 最大通态电阻 (Ron) | 140 Ω | 140 Ω | 140 Ω | 140 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 5.08 mm | 4.57 mm | 2.65 mm |
| 最大供电电流 (Isup) | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA |
| 标称供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
| 表面贴装 | YES | NO | NO | YES |
| 最长断开时间 | 15 ns | 15 ns | 15 ns | 15 ns |
| 最长接通时间 | 15 ns | 15 ns | 15 ns | 15 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm |
| 零件包装代码 | SOIC | DIP | - | SOIC |
| 针数 | 20 | 20 | - | 20 |
| 封装等效代码 | SOP20,.4 | - | DIP20,.3 | SOP20,.4 |
| 电源 | 2/12 V | - | 2/12 V | 2/12 V |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| Base Number Matches | - | 1 | 1 | 1 |
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