RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, CERAMIC, PGA-132
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Intel(英特尔) |
| 包装说明 | CERAMIC, PGA-132 |
| Reach Compliance Code | unknown |
| 其他特性 | SEATED HT-CALCULATED |
| 地址总线宽度 | 32 |
| 位大小 | 32 |
| 边界扫描 | NO |
| 外部数据总线宽度 | 32 |
| 格式 | FLOATING POINT |
| 集成缓存 | YES |
| JESD-30 代码 | S-CPGA-P132 |
| JESD-609代码 | e0 |
| 长度 | 36.802 mm |
| 低功率模式 | NO |
| 端子数量 | 132 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA132,14X14 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 4.061 mm |
| 速度 | 25 MHz |
| 最大压摆率 | 480 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 宽度 | 36.802 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| MG80960MC-25/SM303 | MG80960MC-16/SM301 | MQ80960MC-16/SM304 | MQ80960MC-20/SM305 | MG80960MC-20/SM302 | MQ80960MC-25/SM306 | |
|---|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 16MHz, CMOS, CPGA132, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 16MHz, CMOS, CQFP164 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, CQFP164 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, CPGA132, CERAMIC, PGA-132 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CQFP164 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
| 包装说明 | CERAMIC, PGA-132 | CERAMIC, PGA-132 | QFF, QFL164,1.2SQ,25 | QFF, QFL164,1.2SQ,25 | PGA, PGA132,14X14 | QFF, QFL164,1.2SQ,25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 代码 | S-CPGA-P132 | S-CPGA-P132 | S-XQFP-F164 | S-XQFP-F164 | S-CPGA-P132 | S-XQFP-F164 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 132 | 132 | 164 | 164 | 132 | 164 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| 封装代码 | PGA | PGA | QFF | QFF | PGA | QFF |
| 封装等效代码 | PGA132,14X14 | PGA132,14X14 | QFL164,1.2SQ,25 | QFL164,1.2SQ,25 | PGA132,14X14 | QFL164,1.2SQ,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 速度 | 25 MHz | 16 MHz | 16 MHz | 20 MHz | 20 MHz | 25 MHz |
| 最大压摆率 | 480 mA | 375 mA | 375 mA | 420 mA | 420 mA | 480 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | FLAT | FLAT | PIN/PEG | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 0.635 mm | 0.635 mm | 2.54 mm | 0.635 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | PERPENDICULAR | QUAD |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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